Plastic Packages for Integrated Circuits
Low Plastic Quad Flatpack Package with Top Exposed Pad (LQFP-TEP)
Q128.14x20B 4
D
NOTE: EXPOSED PAD 128 Lead Low Quad Flatpack with Top Exposed Pad D/2
D MILLIMETERS 3 BHB
3 SYMBOL A
B 3 D2 E 4 e
E2 N/4 TIPS
0.20 C A-B D 4X SEE DETAIL "A" TOP VIEW
5 7
D1/2 XX U NT RY E1/2
5 -1.60 0.05 -0.15 A2 1.35 1.40 1.45 7
E1 NOTES
13 22 BSC 4 D1 20 BSC 7, 8 D2 12.20 BSC 14 E 16 BSC 4 E1 14 BSC 7, 8 L CO MAX A E2 D1 NOM A1
D E/2 PIN 1 ID MIN 8.35 BSC
0.45 0.60 N 128 e 0.50 BSC 14
0.75 b 0.17 0.22 0.27 b1 0.17 0.20 0.23 ccc 0.08 ddd 0.08 9 Rev. 1 7/11
4X NOTES: BOTTOM VIEW 0.20 H A-B D 1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994. 8 PLACES
11/13В° 2. Datum plane H located at mold parting line and coincident with
lead, where lead exits plastic body at bottom of parting line. A
2 H 0.05 / / 0.10 C ccc C 4. To be determined at seating plane C. SEE DETAIL "B" 5. Dimensions D1 and E1 do not include mold protrusion. Allowable
protrusion is 0.254mm per side on D1 and E1 dimensions. ddd M C A-B S D S 9 WITH LEAD FINISH b 0.09/0.20 6. “N” is the total number of terminals. …
