Package Intersil V256.13.5x13.5 — 数据表
256薄型,小间距塑料球栅阵列封装
Package Outline Drawing (POD)
参数化
| Family | LFBGA |
| Pin Count | 256 |
| Height max | 1.70 mm |
| Weight | 0.722 g |
| Pitch | 0.80 mm |
| Peak Temperature | 235 °C |
| Lead Free Peak Temperature | 260 °C |
| Features | Low Profile, Fine |
| Package Index | V256.13.5X13.5 |
模型线
系列: BGA (14)
制造商分类
- Plastic Packages
