Datasheet Texas Instruments TMP007 — 数据表
| 制造商 | Texas Instruments |
| 系列 | TMP007 |
带有WCSP封装的集成数学引擎的红外热电堆非接触式温度传感器
数据表
TMP007 Infrared Thermopile Sensor with Integrated Math Engine datasheet
PDF, 1.3 Mb, 修订版: C, 档案已发布: Jul 28, 2015
状态
| TMP007AIYZFR | TMP007AIYZFT | |
|---|---|---|
| Lifecycle Status | NRND (Not recommended for new designs) | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No | No |
打包
| TMP007AIYZFR | TMP007AIYZFT | |
|---|---|---|
| N | 1 | 2 |
| Pin | 8 | 8 |
| Package Type | YZF | YZF |
| Industry STD Term | DSBGA | DSBGA |
| JEDEC Code | S-XBGA-N | S-XBGA-N |
| Package QTY | 3000 | 250 |
| Carrier | LARGE T&R | SMALL T&R |
| Device Marking | TMP007 | TMP007 |
| Width (mm) | 1.75 | 1.75 |
| Length (mm) | 1.75 | 1.75 |
| Pitch (mm) | .5 | .5 |
| Max Height (mm) | .625 | .625 |
| Mechanical Data | 下载 | 下载 |
生态计划
| TMP007AIYZFR | TMP007AIYZFT | |
|---|---|---|
| RoHS | Compliant | Compliant |
应用须知
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, 档案已发布: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, 修订版: AG, 档案已发布: Aug 12, 2015
- Understanding the I2C BusPDF, 124 Kb, 档案已发布: Jun 30, 2015
模型线
系列: TMP007 (2)
制造商分类
- Semiconductors> Sensing Products> Temperature Sensors> IR & Probe Temperature Sensors