Datasheet Texas Instruments SN74LVTH322374 — 数据表

制造商Texas Instruments
系列SN74LVTH322374
Datasheet Texas Instruments SN74LVTH322374

具有三态输出的3.3V ABT 32位边沿触发D型触发器

数据表

SN74LVTH322374 datasheet
PDF, 704 Kb, 修订版: C, 档案已发布: Nov 13, 2006
从文件中提取

价格

状态

74LVTH322374ZKER
Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

74LVTH322374ZKER
N1
Pin96
Package TypeZKE
Industry STD TermBGA MICROSTAR
JEDEC CodeR-PBGA-N
Package QTY1000
CarrierLARGE T&R
Device MarkingHW374
Width (mm)5.5
Length (mm)13.5
Thickness (mm).85
Pitch (mm).8
Max Height (mm)1.4
Mechanical Data下载

参数化

Parameters / Models74LVTH322374ZKER
74LVTH322374ZKER
3-State OutputYes
Bits32
F @ Nom Voltage(Max), Mhz160
ICC @ Nom Voltage(Max), mA10
Operating Temperature Range, C-40 to 85
Output Drive (IOL/IOH)(Max), mA12/-12
Package GroupLFBGA
Package Size: mm2:W x L, PKG96LFBGA: 74 mm2: 5.5 x 13.5(LFBGA)
RatingCatalog
Schmitt TriggerNo
Technology FamilyLVT
VCC(Max), V3.6
VCC(Min), V2.7
Voltage(Nom), V3.3
tpd @ Nom Voltage(Max), ns5.3

生态计划

74LVTH322374ZKER
RoHSCompliant

应用须知

  • LVT Family Characteristics (Rev. A)
    PDF, 98 Kb, 修订版: A, 档案已发布: Mar 1, 1998
    To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
  • LVT-to-LVTH Conversion
    PDF, 84 Kb, 档案已发布: Dec 8, 1998
    Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed.
  • Bus-Hold Circuit
    PDF, 418 Kb, 档案已发布: Feb 5, 2001
    When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, 档案已发布: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015

模型线

系列: SN74LVTH322374 (1)

制造商分类

  • Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop