Datasheet Texas Instruments SN74LVTH162244 — 数据表

制造商Texas Instruments
系列SN74LVTH162244
Datasheet Texas Instruments SN74LVTH162244

具有三态输出的3.3.V ABT 16位缓冲器/驱动器

数据表

SN54LVTH162244; SN74LVTH162244 datasheet
PDF, 939 Kb, 修订版: N, 档案已发布: Nov 1, 2006
从文件中提取

价格

状态

74LVTH162244DLRG474LVTH162244GRDR74LVTH162244ZQLR74LVTH162244ZRDRSN74LVTH162244DGGRSN74LVTH162244DLSN74LVTH162244DLG4SN74LVTH162244DLRSN74LVTH162244KR
Lifecycle StatusActive (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoYesNo

打包

74LVTH162244DLRG474LVTH162244GRDR74LVTH162244ZQLR74LVTH162244ZRDRSN74LVTH162244DGGRSN74LVTH162244DLSN74LVTH162244DLG4SN74LVTH162244DLRSN74LVTH162244KR
N123456789
Pin485456544848484856
Package TypeDLGRDZQLZRDDGGDLDLDLGQL
Industry STD TermSSOPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIORBGA MICROSTAR JUNIORTSSOPSSOPSSOPSSOPBGA MICROSTAR JUNIOR
JEDEC CodeR-PDSO-GR-PBGA-NR-PBGA-NR-PBGA-NR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PBGA-N
Package QTY100010001000200025251000
CarrierLARGE T&RLARGE T&RLARGE T&RLARGE T&RTUBETUBELARGE T&R
Device MarkingLVTH162244LL2244LL2244LVTH162244LVTH162244LVTH162244LVTH162244
Width (mm)7.495.54.55.56.17.497.497.494.5
Length (mm)15.8887812.515.8815.8815.887
Thickness (mm)2.59.8.75.81.152.592.592.59.75
Pitch (mm).635.8.65.8.5.635.635.635.65
Max Height (mm)2.791.211.21.22.792.792.791
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参数化

Parameters / Models74LVTH162244DLRG4
74LVTH162244DLRG4
74LVTH162244GRDR
74LVTH162244GRDR
74LVTH162244ZQLR
74LVTH162244ZQLR
74LVTH162244ZRDR
74LVTH162244ZRDR
SN74LVTH162244DGGR
SN74LVTH162244DGGR
SN74LVTH162244DL
SN74LVTH162244DL
SN74LVTH162244DLG4
SN74LVTH162244DLG4
SN74LVTH162244DLR
SN74LVTH162244DLR
SN74LVTH162244KR
SN74LVTH162244KR
Approx. Price (US$)0.57 | 1ku0.57 | 1ku
Bits16161616161616
Bits(#)1616
F @ Nom Voltage(Max), Mhz160160160160160160160
F @ Nom Voltage(Max)(Mhz)160160
ICC @ Nom Voltage(Max), mA0.0050.0050.0050.0050.0050.0050.005
ICC @ Nom Voltage(Max)(mA)0.0050.005
Input TypeTTL/CMOSTTL/CMOS
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-8.2/19.2-8.2/19.2-8.2/19.2-8.2/19.2-8.2/19.2-8.2/19.2-8.2/19.2
Output Drive (IOL/IOH)(Max)(mA)-8.2/19.2-8.2/19.2
Output TypeLVTTLLVTTL
Package GroupSSOPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIORBGA MICROSTAR JUNIORTSSOPSSOPSSOPSSOPBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG48SSOP: 164 mm2: 10.35 x 15.88(SSOP)56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
Package Size: mm2:W x L (PKG)56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNoNoNo
Technology FamilyLVTLVTLVTLVTLVTLVTLVTLVTLVT
VCC(Max), V3.63.63.63.63.63.63.6
VCC(Max)(V)3.63.6
VCC(Min), V2.72.72.72.72.72.72.7
VCC(Min)(V)2.72.7
Voltage(Nom), V3.33.33.33.33.33.33.3
Voltage(Nom)(V)3.33.3
tpd @ Nom Voltage(Max), ns4444444
tpd @ Nom Voltage(Max)(ns)44

生态计划

74LVTH162244DLRG474LVTH162244GRDR74LVTH162244ZQLR74LVTH162244ZRDRSN74LVTH162244DGGRSN74LVTH162244DLSN74LVTH162244DLG4SN74LVTH162244DLRSN74LVTH162244KR
RoHSCompliantNot CompliantCompliantCompliantCompliantCompliantCompliantCompliantNot Compliant
Pb FreeNoNo

应用须知

  • LVT Family Characteristics (Rev. A)
    PDF, 98 Kb, 修订版: A, 档案已发布: Mar 1, 1998
    To address the need for a complete low-voltage interface solution, Texas Instruments has developed a new generation of logic devices capable of mixed-mode operation. The LVT series relies on a state-of-the-art submicron BiCMOS process to provide up to a 90% reduction in static power dissipation over ABT. LVT devices solve the system need for a transparent seam between the low-voltage and 5-V secti
  • LVT-to-LVTH Conversion
    PDF, 84 Kb, 档案已发布: Dec 8, 1998
    Original LVT devices that have bus hold have been redesigned to add the High-Impedance State During Power Up and Power Down feature. Additional devices with and without bus hold have been added to the LVT product line. Design guidelines and issues related to the bus-hold features, switching characteristics, and timing requirements are discussed.
  • Bus-Hold Circuit
    PDF, 418 Kb, 档案已发布: Feb 5, 2001
    When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, 档案已发布: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou

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制造商分类

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver