Datasheet Texas Instruments SN74LVC2G74-Q1 — 数据表

制造商Texas Instruments
系列SN74LVC2G74-Q1
Datasheet Texas Instruments SN74LVC2G74-Q1

汽车类具有上升沿和预置位的单边沿触发D型触发器

数据表

Single Positive-Edge-Triggered D-Type Flip-Flop With Clear and Preset datasheet
PDF, 761 Kb, 修订版: C, 档案已发布: Apr 9, 2008
从文件中提取

价格

状态

CLVC2G74QDCURG4Q1SN74LVC2G74QDCURQ1
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNo

打包

CLVC2G74QDCURG4Q1SN74LVC2G74QDCURQ1
N12
Pin88
Package TypeDCUDCU
Industry STD TermVSSOPVSSOP
JEDEC CodeR-PDSO-GR-PDSO-G
Package QTY30003000
CarrierLARGE T&RLARGE T&R
Device MarkingC74RC74R
Width (mm)22
Length (mm)2.32.3
Thickness (mm).85.85
Pitch (mm).5.5
Max Height (mm).9.9
Mechanical Data下载下载

参数化

Parameters / ModelsCLVC2G74QDCURG4Q1
CLVC2G74QDCURG4Q1
SN74LVC2G74QDCURQ1
SN74LVC2G74QDCURQ1
3-State OutputNoNo
Bits11
F @ Nom Voltage(Max), Mhz150150
Gate TypeFLIP-FLOPFLIP-FLOP
ICC @ Nom Voltage(Max), mA0.010.01
LogicTrueTrue
Operating Temperature Range, C-40 to 125-40 to 125
Output Drive (IOL/IOH)(Max), mA32/-3232/-32
Package GroupVSSOPVSSOP
Package Size: mm2:W x L, PKG8VSSOP: 6 mm2: 3.1 x 2(VSSOP)8VSSOP: 6 mm2: 3.1 x 2(VSSOP)
RatingAutomotiveAutomotive
Schmitt TriggerNoNo
Special FeaturesIoff,down translation to Vcc,low powerIoff,down translation to Vcc,low power
Sub-FamilyD-Type Flip-FlopD-Type Flip-Flop
Technology FamilyLVCLVC
VCC(Max), V5.55.5
VCC(Min), V1.651.65
Voltage(Nom), V1.8,2.5,3.3,51.8,2.5,3.3,5
tpd @ Nom Voltage(Max), ns14.4,8.1,6.9,5.114.4,8.1,6.9,5.1

生态计划

CLVC2G74QDCURG4Q1SN74LVC2G74QDCURQ1
RoHSCompliantCompliant

应用须知

  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • LVC Characterization Information
    PDF, 114 Kb, 档案已发布: Dec 1, 1996
    This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices.
  • Use of the CMOS Unbuffered Inverter in Oscillator Circuits
    PDF, 796 Kb, 档案已发布: Nov 6, 2003
    CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, 档案已发布: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • How to Select Little Logic (Rev. A)
    PDF, 1.1 Mb, 修订版: A, 档案已发布: Jul 26, 2016
    TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, 档案已发布: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Texas Instruments Little Logic Application Report
    PDF, 359 Kb, 档案已发布: Nov 1, 2002
    Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015

模型线

系列: SN74LVC2G74-Q1 (2)

制造商分类

  • Semiconductors> Logic> Little Logic