Datasheet Texas Instruments SN74AVCH20T245 — 数据表

制造商	Texas Instruments
系列	SN74AVCH20T245

数据表

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参数化

Parameters / Models	74AVCH20T245ZQLR	SN74AVCH20T245GR	SN74AVCH20T245VR
Bits	20	20	20
F @ Nom Voltage(Max), Mhz	100	100	100
ICC @ Nom Voltage(Max), mA	0.065	0.065	0.065
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85
Package Group	BGA MICROSTAR JUNIOR	TSSOP	TVSOP
Package Size: mm2:W x L, PKG	56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR)	56TSSOP: 113 mm2: 8.1 x 14(TSSOP)	56TVSOP: 72 mm2: 6.4 x 11.3(TVSOP)
Rating	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No
Technology Family	AVC	AVC	AVC
VCC(Max), V	3.6	3.6	3.6
VCC(Min), V	1.2	1.2	1.2
Voltage(Nom), V	1.2,1.5,1.8,2.5,3.3	1.2,1.5,1.8,2.5,3.3	1.2,1.5,1.8,2.5,3.3
tpd @ Nom Voltage(Max), ns	3.8,3.6,3.5,3.4	3.8,3.6,3.5,3.4	3.8,3.6,3.5,3.4

生态计划

应用须知

• 下载
  Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
  PDF, 126 Kb, 修订版: B, 档案已发布: Jul 7, 1999
  Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
• 下载
  AVC Logic Family Technology and Applications (Rev. A)
  PDF, 148 Kb, 修订版: A, 档案已发布: Aug 26, 1998
  Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
• 下载
  Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
  PDF, 390 Kb, 修订版: B, 档案已发布: Apr 30, 2015
• 下载
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
• 下载
  Selecting the Right Level Translation Solution (Rev. A)
  PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
  Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati

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• Semiconductors> Logic> Voltage Level Translation> Direction Controlled Voltage Translation