Datasheet Texas Instruments SN74ABT162827A — 数据表

制造商Texas Instruments
系列SN74ABT162827A
Datasheet Texas Instruments SN74ABT162827A

具有三态输出的20位缓冲器/驱动器

数据表

SN54ABT162827A, SN74ABT162827A datasheet
PDF, 352 Kb, 修订版: F, 档案已发布: Jun 8, 2004
从文件中提取

价格

状态

SN74ABT162827ADGGRSN74ABT162827ADLSN74ABT162827ADLR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

打包

SN74ABT162827ADGGRSN74ABT162827ADLSN74ABT162827ADLR
N123
Pin565656
Package TypeDGGDLDL
Industry STD TermTSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY2000201000
CarrierLARGE T&RTUBELARGE T&R
Device MarkingABT162827AABT162827AABT162827A
Width (mm)6.17.497.49
Length (mm)1418.4118.41
Thickness (mm)1.152.592.59
Pitch (mm).5.635.635
Max Height (mm)1.22.792.79
Mechanical Data下载下载下载

参数化

Parameters / ModelsSN74ABT162827ADGGR
SN74ABT162827ADGGR
SN74ABT162827ADL
SN74ABT162827ADL
SN74ABT162827ADLR
SN74ABT162827ADLR
Bits202020
F @ Nom Voltage(Max), Mhz150150150
ICC @ Nom Voltage(Max), mA0.0320.0320.032
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-12/12-12/12-12/12
Package GroupTSSOPSSOPSSOP
Package Size: mm2:W x L, PKG56TSSOP: 113 mm2: 8.1 x 14(TSSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)56SSOP: 191 mm2: 10.35 x 18.42(SSOP)
RatingCatalogCatalogCatalog
Schmitt TriggerNoNoNo
Technology FamilyABTABTABT
VCC(Max), V5.55.55.5
VCC(Min), V4.54.54.5
Voltage(Nom), V555
tpd @ Nom Voltage(Max), ns4.74.74.7

生态计划

SN74ABT162827ADGGRSN74ABT162827ADLSN74ABT162827ADLR
RoHSCompliantCompliantCompliant

应用须知

  • Quad Flatpack No-Lead Logic Packages (Rev. D)
    PDF, 1.0 Mb, 修订版: D, 档案已发布: Feb 16, 2004
    Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
  • Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
    PDF, 528 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
  • Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
    PDF, 115 Kb, 修订版: A, 档案已发布: Mar 1, 1997
    Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Kb, 修订版: A, 档案已发布: Dec 1, 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, 档案已发布: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

模型线

制造商分类

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Non-Inverting Buffer/Driver