Datasheet Texas Instruments SN65LVDS31D — 数据表
| 制造商 | Texas Instruments |
| 系列 | SN65LVDS31 |
| 零件号 | SN65LVDS31D |
400 Mbps LVDS四路高速差分驱动器16-SOIC -40至85
数据表
SNx5LVDS31, SN65LVDS3487, SN65LVDS9638: High-Speed Differential Line Drivers datasheet
PDF, 1.9 Mb, 修订版: M, 档案已发布: Jul 29, 2014
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价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
打包
| Pin | 16 |
| Package Type | D |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 40 |
| Carrier | TUBE |
| Device Marking | LVDS31 |
| Width (mm) | 3.91 |
| Length (mm) | 9.9 |
| Thickness (mm) | 1.58 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 1.75 |
| Mechanical Data | 下载 |
参数化
| Device Type | Driver |
| ESD HBM | 8 kV |
| Function | Driver |
| ICC(Max) | 35 mA |
| Input Signal | LVTTL |
| No. of Tx | 4 |
| Operating Temperature Range | -40 to 85 C |
| Output Signal | LVDS |
| Package Group | SOIC |
| Package Size: mm2:W x L | 16SOIC: 59 mm2: 6 x 9.9(SOIC) PKG |
| Protocols | LVDS |
| Signaling Rate | 400 Mbps |
生态计划
| RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: SN65LVDS31-32BEVM
SN65LVDS31-32BEVM Evaluation Module for LVDS31 and LVDS32B
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: SN65LVDS31-32EVM
SN65LVDS31-32EVM Evaluation Module for LVDS31 and LVDS32
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: SN65LVDS31-33EVM
Evaluation Module for SN65LVDS31 and SN65LVDS33
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Performance of LVDS with Different Cables (Rev. B)PDF, 246 Kb, 修订版: B, 档案已发布: Feb 11, 2002
This application report focuses on cable for use with LVDS devices rather than printed-circuit board interconnections. After a brief introduction to LVDS, the signal quality of seven different cables is evaluated using eye pattern measurements and TI's LVDS evaluation modules (EVMs). Since data transmission cable covers a wide range of cost and performance, this paper provides guidance for cable s - LVDS Multidrop Connections (Rev. A)PDF, 809 Kb, 修订版: A, 档案已发布: Feb 11, 2002
This application report describes design considerations for low-voltage differential swing (LVDS) multidrop connections. The report describes the maximum number of receivers possible versus signaling rate, signal quality, line length, output jitter, and common-mode voltage range when multidrop testing on a single LVDS line driver transmitting to numerous daisy-chained LVDS receivers.The LVDS rec
模型线
系列: SN65LVDS31 (9)
制造商分类
- Semiconductors > Interface > LVDS/M-LVDS/PECL > Buffers, Drivers/Receivers and Cross-Points