Datasheet Texas Instruments SN54HCT04-SP — 数据表

制造商Texas Instruments
系列SN54HCT04-SP
Datasheet Texas Instruments SN54HCT04-SP

六角逆变器

数据表

SN54HCT04, SN74HCT04 datasheet
PDF, 1.2 Mb, 修订版: D, 档案已发布: Jul 15, 2003
从文件中提取

价格

状态

5962-8974701VCA5962-8974701VDA
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNo

打包

5962-8974701VCA5962-8974701VDA
N12
Pin1414
Package TypeJW
Industry STD TermCDIPCFP
JEDEC CodeR-GDIP-TR-GDFP-F
Package QTY11
CarrierTUBETUBE
Width (mm)6.675.97
Length (mm)19.569.21
Thickness (mm)4.571.59
Pitch (mm)2.541.27
Max Height (mm)5.082.03
Mechanical Data下载下载

参数化

Parameters / Models5962-8974701VCA
5962-8974701VCA
5962-8974701VDA
5962-8974701VDA
Bits66
Input TypeTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125
Output TypeCMOSCMOS
Package GroupCDIPCFP
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CFP)
RatingSpaceSpace
Schmitt TriggerNoNo
Technology FamilyHCTHCT
VCC(Max), V5.55.5
VCC(Min), V4.54.5
Voltage(Nom), V55

生态计划

5962-8974701VCA5962-8974701VDA
RoHSSee ti.comSee ti.com

应用须知

  • SN54/74HCT CMOS Logic Family Applications and Restrictions
    PDF, 102 Kb, 档案已发布: May 1, 1996
    The TI SN54/74HCT family of CMOS devices is a subgroup of the SN74HC series with the HCT circuitry modified to meet the interfacing requirements of TTL outputs to high-speed CMOS inputs. The HCT devices can be driven by the TTL circuits directly without additional components. This document describes the TTL/HC interface the operating voltages circuit noise and power consumption. A Bergeron anal
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, 档案已发布: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

模型线

系列: SN54HCT04-SP (2)

制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers