Datasheet Texas Instruments SN54F30 — 数据表

制造商Texas Instruments
系列SN54F30
Datasheet Texas Instruments SN54F30

8输入正与非门

数据表

8-Input Positive-NAND Gates datasheet
PDF, 873 Kb, 修订版: A, 档案已发布: Oct 1, 1993
从文件中提取

价格

状态

5962-88708012A5962-8870801CA5962-8870801DASN54F30JSNJ54F30FKSNJ54F30JSNJ54F30W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNo

打包

5962-88708012A5962-8870801CA5962-8870801DASN54F30JSNJ54F30FKSNJ54F30JSNJ54F30W
N1234567
Pin20141414201414
Package TypeFKJWJFKJW
Industry STD TermLCCCCDIPCFPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY1111111
CarrierTUBETUBETUBETUBETUBETUBETUBE
Width (mm)8.896.675.976.678.896.675.97
Length (mm)8.8919.569.2119.568.8919.569.21
Thickness (mm)1.834.571.594.571.834.571.59
Pitch (mm)1.272.541.272.541.272.541.27
Max Height (mm)2.035.082.035.082.035.082.03
Mechanical Data下载下载下载下载下载下载下载
Device MarkingSN54F30J30FK5962-8870801CA5962-8870801DA

参数化

Parameters / Models5962-88708012A
5962-88708012A
5962-8870801CA
5962-8870801CA
5962-8870801DA
5962-8870801DA
SN54F30J
SN54F30J
SNJ54F30FK
SNJ54F30FK
SNJ54F30J
SNJ54F30J
SNJ54F30W
SNJ54F30W
Bits1111111
F @ Nom Voltage(Max), Mhz70707070707070
ICC @ Nom Voltage(Max), mA0.0040.0040.0040.0040.0040.0040.004
Input TypeTTLTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA1/-201/-201/-201/-201/-201/-201/-20
Output TypeTTLTTLTTLTTLTTLTTLTTL
Package GroupLCCCCDIPCFPCDIPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNoNo
Technology FamilyFFFFFFF
VCC(Max), V5.55.55.55.55.55.55.5
VCC(Min), V4.54.54.54.54.54.54.5
tpd @ Nom Voltage(Max), ns5.55.55.55.55.55.55.5

生态计划

5962-88708012A5962-8870801CA5962-8870801DASN54F30JSNJ54F30FKSNJ54F30JSNJ54F30W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

应用须知

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015

模型线

制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products