Datasheet Texas Instruments 5962-8952501LA — 数据表

制造商Texas Instruments
系列SN54AS823A
零件号5962-8952501LA
Datasheet Texas Instruments 5962-8952501LA

具有三态输出的9位总线接口触发器24-CDIP -55至125

数据表

9-Bit Bus Interface Flip-Flops With 3-State Outputs datasheet
PDF, 148 Kb, 修订版: A, 档案已发布: Aug 1, 1995
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin24
Package TypeJT
Industry STD TermCDIP
JEDEC CodeR-GDIP-T
Package QTY1
CarrierTUBE
Width (mm)6.92
Length (mm)32
Thickness (mm)4.7
Pitch (mm)2.54
Max Height (mm)5.08
Mechanical Data下载

参数化

3-State OutputYes
Bits9
F @ Nom Voltage(Max)125 Mhz
ICC @ Nom Voltage(Max)103 mA
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output Drive (IOL/IOH)(Max)48/-24 mA
Output TypeTTL
Package GroupCDIP
Package Size: mm2:W x LSee datasheet (CDIP) PKG
RatingMilitary
Technology FamilyAS
VCC(Max)5.5 V
VCC(Min)4.5 V
tpd @ Nom Voltage(Max)13 ns

生态计划

RoHSSee ti.com

应用须知

  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Mb, 档案已发布: Aug 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • Advanced Schottky Load Management
    PDF, 277 Kb, 档案已发布: Feb 1, 1997
    Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

模型线

系列: SN54AS823A (2)

制造商分类

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

其他名称:

59628952501LA, 5962 8952501LA