Datasheet Texas Instruments SN54AS808B — 数据表

制造商Texas Instruments
系列SN54AS808B
Datasheet Texas Instruments SN54AS808B

十六进制2输入和驱动器

数据表

Hex 2-Input And Drivers datasheet
PDF, 608 Kb, 修订版: C, 档案已发布: Jan 1, 1995
从文件中提取

价格

状态

5962-88522012A5962-8852201RA5962-8852201SASN54AS808BJSNJ54AS808BFKSNJ54AS808BJ
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNo

打包

5962-88522012A5962-8852201RA5962-8852201SASN54AS808BJSNJ54AS808BFKSNJ54AS808BJ
N123456
Pin202020202020
Package TypeFKJJJFKJ
Industry STD TermLCCCCDIPCDIPCDIPLCCCCDIP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDIP-TR-GDIP-TS-CQCC-NR-GDIP-T
Package QTY11111
CarrierTUBETUBETUBETUBETUBE
Width (mm)8.896.926.926.928.896.92
Length (mm)8.8924.224.224.28.8924.2
Thickness (mm)1.834.574.574.571.834.57
Pitch (mm)1.272.542.542.541.272.54
Max Height (mm)2.035.085.085.082.035.08
Mechanical Data下载下载下载下载下载下载
Device MarkingSN54AS808BJSNJ54AS5962-8852201RA

参数化

Parameters / Models5962-88522012A
5962-88522012A
5962-8852201RA
5962-8852201RA
5962-8852201SA
5962-8852201SA
SN54AS808BJ
SN54AS808BJ
SNJ54AS808BFK
SNJ54AS808BFK
SNJ54AS808BJ
SNJ54AS808BJ
Bits66666
F @ Nom Voltage(Max), Mhz125125125125125
ICC @ Nom Voltage(Max), mA0.0130.0130.0130.0130.013
Input TypeTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Operating Temperature Range(C)-55 to 125
Output Drive (IOL/IOH)(Max), mA-2/20-2/20-2/20-2/20-2/20
Output TypeTTLTTLTTLTTLTTLTTL
Package GroupLCCCCDIPCDIPCDIPLCCCCDIP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)
Package Size: mm2:W x L (PKG)See datasheet (CDIP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerNoNoNoNoNoNo
Technology FamilyASASASASASAS
VCC(Max), V5.55.55.55.55.5
VCC(Max)(V)5.5
VCC(Min), V4.54.54.54.54.5
VCC(Min)(V)4.5
tpd @ Nom Voltage(Max), ns6.56.56.56.56.5
tpd @ Nom Voltage(Max)(ns)6.5

生态计划

5962-88522012A5962-8852201RA5962-8852201SASN54AS808BJSNJ54AS808BFKSNJ54AS808BJ
RoHSSee ti.comSee ti.comNot CompliantSee ti.comSee ti.comSee ti.com
Pb FreeNo

应用须知

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Mb, 档案已发布: Aug 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Advanced Schottky Load Management
    PDF, 277 Kb, 档案已发布: Feb 1, 1997
    Designers of high-speed systems that include advanced Schottky (AS) devices must consider the operating environment in their work. They must be aware of the individual device characteristics and their interaction with other devices. This document provides a detailed discussion of the waveform characteristics equivalent circuit models transmission line fanout and termination for AS load manageme
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015
  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, 档案已发布: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a

模型线

制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Gate Products