Datasheet Texas Instruments SN54ALS646 — 数据表

制造商Texas Instruments
系列SN54ALS646
Datasheet Texas Instruments SN54ALS646

具有三态输出的八路寄存总线收发器

数据表

Octal Bus Transceivers & Registers With 3 -State Outputs datasheet
PDF, 890 Kb, 修订版: F, 档案已发布: Jan 1, 1995
从文件中提取

价格

状态

5962-8995601LASNJ54ALS646JTSNJ54ALS646W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)
Manufacture's Sample AvailabilityNoNoNo

打包

5962-8995601LASNJ54ALS646JTSNJ54ALS646W
N123
Pin242424
Package TypeJTJTW
Industry STD TermCDIPCDIPCFP
JEDEC CodeR-GDIP-TR-GDIP-TR-GDFP-F
Package QTY11
CarrierTUBETUBE
Width (mm)6.926.929.09
Length (mm)323214.36
Thickness (mm)4.74.71.72
Pitch (mm)2.542.541.27
Max Height (mm)5.085.082.29
Mechanical Data下载下载下载
Device Marking5962-8995601LA

参数化

Parameters / Models5962-8995601LA
5962-8995601LA
SNJ54ALS646JT
SNJ54ALS646JT
SNJ54ALS646W
SNJ54ALS646W
Operating Temperature Range, C-55 to 125-55 to 125
Operating Temperature Range(C)-55 to 125
Package GroupCDIPCDIPCDIP
Package Size: mm2:W x L, PKGSee datasheet (CDIP)See datasheet (CDIP)
Package Size: mm2:W x L (PKG)See datasheet (CFP)
See datasheet (CDIP)
RatingMilitaryMilitaryMilitary
Schmitt TriggerNoNoNo
Technology FamilyALSALSALS

生态计划

5962-8995601LASNJ54ALS646JTSNJ54ALS646W
RoHSSee ti.comSee ti.comNot Compliant
Pb FreeNo

应用须知

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Advanced Schottky (ALS and AS) Logic Families
    PDF, 1.9 Mb, 档案已发布: Aug 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015

模型线

制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers