Datasheet Texas Instruments SN54ABTE16245 — 数据表

制造商Texas Instruments
系列SN54ABTE16245
Datasheet Texas Instruments SN54ABTE16245

具有三态输出的16位入射波开关总线收发器

数据表

16-Bit Incident-Wave Switching Bus Transceivers With 3-State Outputs datasheet
PDF, 779 Kb, 修订版: J, 档案已发布: Dec 13, 2001
从文件中提取

价格

状态

5962-9677501QXASNJ54ABTE16245WD
Lifecycle StatusNRND (Not recommended for new designs)NRND (Not recommended for new designs)
Manufacture's Sample AvailabilityNoNo

打包

5962-9677501QXASNJ54ABTE16245WD
N12
Pin4848
Package TypeWDWD
Industry STD TermCFPCFP
JEDEC CodeR-GDFP-FR-GDFP-F
Package QTY11
CarrierTUBETUBE
Device MarkingSNJ54ABTE16245SNJ54ABTE16245
Width (mm)9.669.66
Length (mm)15.8815.88
Thickness (mm)2.482.48
Pitch (mm).635.635
Max Height (mm)3.053.05
Mechanical Data下载下载

生态计划

5962-9677501QXASNJ54ABTE16245WD
RoHSSee ti.comSee ti.com

应用须知

  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
    PDF, 80 Kb, 修订版: A, 档案已发布: Dec 1, 1996
    This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015

模型线

系列: SN54ABTE16245 (2)

制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers