Datasheet Texas Instruments 5962-9557501QEA — 数据表

制造商Texas Instruments
系列SN5476
零件号5962-9557501QEA
Datasheet Texas Instruments 5962-9557501QEA

具有预置和清晰16-CDIP -55至125的双JK触发器

数据表

Dual J-K Flip-Flops With Preset And Clear datasheet
PDF, 339 Kb, 档案已发布: Mar 1, 1988
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin161616
Package TypeJJJ
Industry STD TermCDIPCDIPCDIP
JEDEC CodeR-GDIP-TR-GDIP-TR-GDIP-T
Package QTY111
CarrierTUBETUBETUBE
Device MarkingA5962-9557501QESNJ5476J
Width (mm)6.926.926.92
Length (mm)19.5619.5619.56
Thickness (mm)4.574.574.57
Pitch (mm)2.542.542.54
Max Height (mm)5.085.085.08
Mechanical Data下载下载下载

生态计划

RoHSSee ti.com

应用须知

  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015

模型线

制造商分类

  • Semiconductors > Space & High Reliability > Logic Products > Flip-Flop/Latch/Registers

其他名称:

59629557501QEA, 5962 9557501QEA