Datasheet Texas Instruments OMAP3530 — 数据表

制造商Texas Instruments
系列OMAP3530
Datasheet Texas Instruments OMAP3530

应用处理器

数据表

OMAP3530 and OMAP3525 Applications Processors datasheet
PDF, 2.7 Mb, 修订版: H, 档案已发布: Oct 10, 2013
从文件中提取

价格

状态

3530ECBCAMERCURY3530ECUSAGRMOMAP3530DCBBOMAP3530DCBB72OMAP3530DCBBAOMAP3530DCBCOMAP3530DCBC72OMAP3530DCBCAOMAP3530DCUSOMAP3530DCUS72OMAP3530DCUSAOMAP3530ECBBOMAP3530ECBB72OMAP3530ECBBAOMAP3530ECBBALPDOMAP3530ECBBAROMAP3530ECBBLPDOMAP3530ECBCOMAP3530ECBC72OMAP3530ECBCAOMAP3530ECUSOMAP3530ECUS72OMAP3530ECUSA
Lifecycle StatusNRND (Not recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNoNo

打包

3530ECBCAMERCURY3530ECUSAGRMOMAP3530DCBBOMAP3530DCBB72OMAP3530DCBBAOMAP3530DCBCOMAP3530DCBC72OMAP3530DCBCAOMAP3530DCUSOMAP3530DCUS72OMAP3530DCUSAOMAP3530ECBBOMAP3530ECBB72OMAP3530ECBBAOMAP3530ECBBALPDOMAP3530ECBBAROMAP3530ECBBLPDOMAP3530ECBCOMAP3530ECBC72OMAP3530ECBCAOMAP3530ECUSOMAP3530ECUS72OMAP3530ECUSA
N1234567891011121314151617181920212223
Pin515423515515515515515515423423423515515515515515515515515515423423423
Package TypeCBCCUSCBBCBBCBBCBCCBCCBCCUSCUSCUSCBBCBBCBBCBBCBBCBBCBCCBCCBCCUSCUSCUS
Industry STD TermPOP-FCBGAFC/CSPPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAFC/CSPFC/CSPFC/CSPPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAPOP-FCBGAFC/CSPFC/CSPFC/CSP
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY119901681681681681000168119119119909090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device Marking3530ECBCA3530DCBB3530DCBB723530DCBB3530DCBC3530DCBC723530DCBC3530DCUS3530DCUS72A3530ECBB3530ECBB72AAA3530ECBB3530ECBC3530ECBC723530ECBC3530ECUS3530ECUS723530ECUS
Width (mm)1416121212141414161616121212121212141414161616
Length (mm)1416121212141414161616121212121212141414161616
Thickness (mm)0.630.96.61.61.61.63.63.63.96.96.96.61.61.61.61.61.61.63.63.63.96.96.96
Pitch (mm)0.50.65.4.4.4.5.5.5.65.65.65.4.4.4.4.4.4.5.5.5.65.65.65
Max Height (mm)0.951.4.9.9.9.95.95.951.41.41.4.9.9.9.9.9.9.95.95.951.41.41.4
Mechanical Data下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载下载

参数化

Parameters / Models3530ECBCAMERCURY
3530ECBCAMERCURY
3530ECUSAGRM
3530ECUSAGRM
OMAP3530DCBB
OMAP3530DCBB
OMAP3530DCBB72
OMAP3530DCBB72
OMAP3530DCBBA
OMAP3530DCBBA
OMAP3530DCBC
OMAP3530DCBC
OMAP3530DCBC72
OMAP3530DCBC72
OMAP3530DCBCA
OMAP3530DCBCA
OMAP3530DCUS
OMAP3530DCUS
OMAP3530DCUS72
OMAP3530DCUS72
OMAP3530DCUSA
OMAP3530DCUSA
OMAP3530ECBB
OMAP3530ECBB
OMAP3530ECBB72
OMAP3530ECBB72
OMAP3530ECBBA
OMAP3530ECBBA
OMAP3530ECBBALPD
OMAP3530ECBBALPD
OMAP3530ECBBAR
OMAP3530ECBBAR
OMAP3530ECBBLPD
OMAP3530ECBBLPD
OMAP3530ECBC
OMAP3530ECBC
OMAP3530ECBC72
OMAP3530ECBC72
OMAP3530ECBCA
OMAP3530ECBCA
OMAP3530ECUS
OMAP3530ECUS
OMAP3530ECUS72
OMAP3530ECUS72
OMAP3530ECUSA
OMAP3530ECUSA
2D & 3D GraphicsHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware AcceleratedHardware Accelerated
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.720720720720720720720720720720720720
ARM MHz (Max.)720720720720720720720720720
Approx. Price (US$)52.08 | 100u52.08 | 100u52.08 | 100u52.08 | 100u52.08 | 100u52.08 | 100u52.08 | 100u52.08 | 100u52.08 | 100u
Approx. price, US$40.212 | 100u40.212 | 100u
Arm CPU1 Arm Cortex-A81 Arm Cortex-A8
Arm MHz, Max.720720
CPU32-bit32-bit
Co-processor, sGPU,DSPGPU,DSP
Display typeParallel Digital Output,Up to 24-Bit RGB Compatible,HD Maximum Resolution ?? ETM Interface,Supports Up to 2 LCD Panels,Support for Remote Frame Buffer,Interface (RFBI) LCD PanelsParallel Digital Output,Up to 24-Bit RGB Compatible,HD Maximum Resolution ?? ETM Interface,Supports Up to 2 LCD Panels,Support for Remote Frame Buffer,Interface (RFBI) LCD Panels
Integrated TI C64x DSPUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHzUp to 520 MHz
Memory Interface, Dual Channel1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC1 16-bit LPDDR , 1 32-bit SDRC
Memory Interface (Dual Channel)1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
1 16-bit LPDDR
1 32-bit SDRC
Operating systemLinux,RTOSLinux,RTOS
Operating temperature range, C-40 to 105,0 to 90-40 to 105,0 to 90
Package GroupFCBGA|423,POP-FCBGA|515FCBGA|423,POP-FCBGA|515
Package size: mm2:W x L, PKG423FCBGA: 256 mm2: 16 x 16 (FCBGA|423),515POP-FCBGA: 144 mm2: 12 x 12 (POP-FCBGA|515)423FCBGA: 256 mm2: 16 x 16 (FCBGA|423),515POP-FCBGA: 144 mm2: 12 x 12 (POP-FCBGA|515)
PerformanceD1D1D1D1D1D1D1D1D1D1D1D1D1D1D1D1D1D1D1D1D1
Process Node65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm65nm
RatingCatalogCatalog

生态计划

3530ECBCAMERCURY3530ECUSAGRMOMAP3530DCBBOMAP3530DCBB72OMAP3530DCBBAOMAP3530DCBCOMAP3530DCBC72OMAP3530DCBCAOMAP3530DCUSOMAP3530DCUS72OMAP3530DCUSAOMAP3530ECBBOMAP3530ECBB72OMAP3530ECBBAOMAP3530ECBBALPDOMAP3530ECBBAROMAP3530ECBBLPDOMAP3530ECBCOMAP3530ECBC72OMAP3530ECBCAOMAP3530ECUSOMAP3530ECUS72OMAP3530ECUSA
RoHSCompliantCompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantNot CompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant
Pb FreeNoNoNoNoNoNoNoNoNoYesYes

应用须知

  • OMAP3530 Power Consumption Summary
    PDF, 19 Kb, 档案已发布: Jan 8, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at: http://wiki.davincidsp.com/index.php/OMAP3530_Power_Estimation_Spreadsheet.

    Power consumption on the OMAP3530 device is highly application-dependent therefore a sp

  • OMAP3530 Easy CUS Package PCB Escape Routing (Rev. A)
    PDF, 2.6 Mb, 修订版: A, 档案已发布: Mar 25, 2010
    The OMAP3530 CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil diameter and 10 mil finished hole size via; it is cost and time effective. This application report shows how to easily route the entire package by first routing one quadrant only and then copying i
  • Ultrasound Scan Conversion on TI's C64x+ DSPs
    PDF, 656 Kb, 档案已发布: Apr 3, 2009
    One of the recent significant developments in ultrasound is the emergence of portable and handheld ultrasound machines and their rapid acceptance in the market place.Because of their power efficiency and high performance digital signal processor (DSP) based devices have been increasingly used as the main processing engine in these portable and hand carried units.

    This application report dis

  • OMAP35x Linux PSP Data Sheet
    PDF, 1.6 Mb, 档案已发布: Oct 16, 2009
  • OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
    PDF, 27 Kb, 档案已发布: Nov 13, 2009
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

    Reflow profiles are dependent on numerous factors including package type number of components bo

  • OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
    PDF, 372 Kb, 修订版: B, 档案已发布: Jun 26, 2008
    It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
  • Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
    PDF, 181 Kb, 修订版: B, 档案已发布: Mar 2, 2009
  • OMAP35x to AM35x Hardware Migration Guide
    PDF, 19 Kb, 档案已发布: May 24, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

    This article describes hardware device considerations to migrate a design

  • OMAP35x to AM37x Hardware Migration Guide
    PDF, 37 Kb, 档案已发布: Jun 3, 2010
    This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

    http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

    The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

  • PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
    PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
    Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
  • PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
    PDF, 2.4 Mb, 修订版: A, 档案已发布: Nov 1, 2013
    Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

    PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

  • PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
    PDF, 1.2 Mb, 档案已发布: Jun 23, 2010
    Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
  • PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
    PDF, 2.0 Mb, 档案已发布: Jun 23, 2010
    Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

    Fine-pitch PCB design is a team effort and may require more than

  • Running a TMS320C64x+ Codec Across TMS320C64x+ Based DSP Platforms
    PDF, 969 Kb, 档案已发布: Sep 24, 2009
    This application report describes the device differences to be taken care for running the C64x+™ video codec software on different C64x+ based platforms. This document assumes that the codec software is developed for the C64x+ digital signal processor (DSP) core. As many TI platforms have a C64x+ DSP this document gives the details for running the standalone codec software on a C64x+ platfo
  • Introduction to TMS320C6000 DSP Optimization
    PDF, 535 Kb, 档案已发布: Oct 6, 2011
    The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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