Datasheet Texas Instruments MSP430F6658 — 数据表

制造商Texas Instruments
系列MSP430F6658
Datasheet Texas Instruments MSP430F6658

MSP430F66x混合信号微控制器

数据表

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, 修订版: C, 档案已发布: Oct 21, 2013
从文件中提取

价格

状态

MSP430F6658IPZMSP430F6658IPZRMSP430F6658IZQWR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNo

打包

MSP430F6658IPZMSP430F6658IPZRMSP430F6658IZQWR
N123
Pin100100113
Package TypePZPZZQW
Industry STD TermLQFPLQFPBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-GS-PQFP-GS-PBGA-N
Package QTY9010002500
CarrierJEDEC TRAY (10+1)LARGE T&RLARGE T&R
Device MarkingF6658F6658F6658
Width (mm)14147
Length (mm)14147
Thickness (mm)1.41.4.74
Pitch (mm).5.5.5
Max Height (mm)1.61.61
Mechanical Data下载下载下载

参数化

Parameters / ModelsMSP430F6658IPZ
MSP430F6658IPZ
MSP430F6658IPZR
MSP430F6658IPZR
MSP430F6658IZQWR
MSP430F6658IZQWR
ADCADC12 - 12chADC12 - 12chADC12 - 12ch
AESN/AN/AN/A
Active Power, uA/MHz370370370
Additional FeaturesUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUSBUSBUSB
CPUMSP430MSP430MSP430
Comparators121212
DMA666
Featuredf6f6f6
Frequency, MHz202020
GPIO Pins747474
I2C333
Max VCC3.63.63.6
Min VCC1.81.81.8
Multiplier32x3232x3232x32
Non-volatile Memory, KB384384384
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Package GroupLQFPLQFPBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB343434
RatingCatalogCatalogCatalog
SPI666
Special I/ON/AN/AN/A
Standby Power, LPM3-uA2.62.62.6
Timers - 16-bit444
UART333
Wakeup Time, us333

生态计划

MSP430F6658IPZMSP430F6658IPZRMSP430F6658IZQWR
RoHSCompliantCompliantCompliant

应用须知

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Kb, 修订版: B, 档案已发布: Jun 4, 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • Starting a USB Design Using MSP430 MCUs (Rev. A)
    PDF, 949 Kb, 修订版: A, 档案已发布: May 30, 2014
    This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package
  • Designing With MSP430 and Segment LCDs (Rev. A)
    PDF, 2.1 Mb, 修订版: A, 档案已发布: Jul 20, 2015
    Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, 档案已发布: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Kb, 档案已发布: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

模型线

制造商分类

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x