Datasheet Texas Instruments MSP430F5659 — 数据表

制造商Texas Instruments
系列MSP430F5659
Datasheet Texas Instruments MSP430F5659

MSP430F56xx混合信号微控制器

数据表

MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, 修订版: C, 档案已发布: Oct 21, 2013
从文件中提取

价格

状态

MSP430F5659IPZMSP430F5659IPZRMSP430F5659IZQWRMSP430F5659IZQWT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNoYesYes

打包

MSP430F5659IPZMSP430F5659IPZRMSP430F5659IZQWRMSP430F5659IZQWT
N1234
Pin100100113113
Package TypePZPZZQWZQW
Industry STD TermLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
JEDEC CodeS-PQFP-GS-PQFP-GS-PBGA-NS-PBGA-N
Package QTY9010002500250
CarrierJEDEC TRAY (10+1)LARGE T&RLARGE T&RSMALL T&R
Device MarkingF5659F5659F5659F5659
Width (mm)141477
Length (mm)141477
Thickness (mm)1.41.4.74.74
Pitch (mm).5.5.5.5
Max Height (mm)1.61.611
Mechanical Data下载下载下载下载

参数化

Parameters / ModelsMSP430F5659IPZ
MSP430F5659IPZ
MSP430F5659IPZR
MSP430F5659IPZR
MSP430F5659IZQWR
MSP430F5659IZQWR
MSP430F5659IZQWT
MSP430F5659IZQWT
ADCADC12 - 12chADC12 - 12chADC12 - 12chADC12 - 12ch
AESN/AN/AN/AN/A
Active Power, uA/MHz370370370370
Additional FeaturesUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDAUSB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSLUSBUSBUSBUSB
CPUMSP430MSP430MSP430MSP430
Comparators12121212
DMA6666
Featuredf5f5f5f5
Frequency, MHz20202020
GPIO Pins74747474
I2C3333
Max VCC3.63.63.63.6
Min VCC1.81.81.81.8
Multiplier32x3232x3232x3232x32
Non-volatile Memory, KB512512512512
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85
Package GroupLQFPLQFPBGA MICROSTAR JUNIORBGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG100LQFP: 256 mm2: 16 x 16(LQFP)100LQFP: 256 mm2: 16 x 16(LQFP)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB66666666
RatingCatalogCatalogCatalogCatalog
SPI6666
Special I/ON/AN/AN/AN/A
Standby Power, LPM3-uA2.62.62.62.6
Timers - 16-bit4444
UART3333
Wakeup Time, us3333

生态计划

MSP430F5659IPZMSP430F5659IPZRMSP430F5659IZQWRMSP430F5659IZQWT
RoHSCompliantCompliantCompliantCompliant

应用须知

  • Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
    PDF, 135 Kb, 修订版: B, 档案已发布: Jun 4, 2015
    Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
  • Starting a USB Design Using MSP430 MCUs (Rev. A)
    PDF, 949 Kb, 修订版: A, 档案已发布: May 30, 2014
    This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package
  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Kb, 档案已发布: Oct 2, 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, 档案已发布: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • ESD Diode Current Specification
    PDF, 520 Kb, 档案已发布: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

模型线

制造商分类

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x