Datasheet Texas Instruments MSP430F5335 — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430F5335 |
MSP430F533x混合信号微控制器
数据表
价格
状态
| MSP430F5335IPZ | MSP430F5335IPZR | MSP430F5335IZQWR | MSP430F5335IZQWT | |
|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | Yes | Yes | No |
打包
| MSP430F5335IPZ | MSP430F5335IPZR | MSP430F5335IZQWR | MSP430F5335IZQWT | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 100 | 100 | 113 | 113 |
| Package Type | PZ | PZ | ZQW | ZQW |
| Industry STD Term | LQFP | LQFP | BGA MICROSTAR JUNIOR | BGA MICROSTAR JUNIOR |
| JEDEC Code | S-PQFP-G | S-PQFP-G | S-PBGA-N | S-PBGA-N |
| Package QTY | 90 | 1000 | 2500 | 250 |
| Carrier | JEDEC TRAY (10+1) | LARGE T&R | LARGE T&R | SMALL T&R |
| Device Marking | M430F5335 | M430F5335 | M430F5335 | M430F5335 |
| Width (mm) | 14 | 14 | 7 | 7 |
| Length (mm) | 14 | 14 | 7 | 7 |
| Thickness (mm) | 1.4 | 1.4 | .74 | .74 |
| Pitch (mm) | .5 | .5 | .5 | .5 |
| Max Height (mm) | 1.6 | 1.6 | 1 | 1 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 |
参数化
| Parameters / Models | MSP430F5335IPZ | MSP430F5335IPZR | MSP430F5335IZQWR | MSP430F5335IZQWT |
|---|---|---|---|---|
| ADC | ADC12 - 12ch | ADC12 - 12ch | ADC12 - 12ch | ADC12 - 12ch |
| AES | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 330 | 330 | 330 | 330 |
| Additional Features | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA | Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA |
| BSL | UART | UART | UART | UART |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 |
| Comparators | 12 | 12 | 12 | 12 |
| DMA | 6 | 6 | 6 | 6 |
| Featured | f5 | f5 | f5 | f5 |
| Frequency, MHz | 20 | 20 | 20 | 20 |
| GPIO Pins | 74 | 74 | 74 | 74 |
| I2C | 2 | 2 | 2 | 2 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | 32x32 | 32x32 | 32x32 | 32x32 |
| Non-volatile Memory, KB | 256 | 256 | 256 | 256 |
| Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
| Package Group | LQFP | LQFP | BGA MICROSTAR JUNIOR | BGA MICROSTAR JUNIOR |
| Package Size: mm2:W x L, PKG | 100LQFP: 256 mm2: 16 x 16(LQFP) | 100LQFP: 256 mm2: 16 x 16(LQFP) | 113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) | 113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) |
| RAM, KB | 18 | 18 | 18 | 18 |
| Rating | Catalog | Catalog | Catalog | Catalog |
| SPI | 4 | 4 | 4 | 4 |
| Special I/O | N/A | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 2.2 | 2.2 | 2.2 | 2.2 |
| Timers - 16-bit | 4 | 4 | 4 | 4 |
| UART | 2 | 2 | 2 | 2 |
| Wakeup Time, us | 3 | 3 | 3 | 3 |
生态计划
| MSP430F5335IPZ | MSP430F5335IPZR | MSP430F5335IZQWR | MSP430F5335IZQWT | |
|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant |
应用须知
- Using the MSP430 Timer_D Module in Hi-Resolution ModePDF, 870 Kb, 档案已发布: Oct 2, 2013
This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration - Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)PDF, 151 Kb, 修订版: D, 档案已发布: Nov 3, 2016
This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - Design Considerations When Using the MSP430 Graphics LibraryPDF, 475 Kb, 档案已发布: Oct 5, 2012
LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This - MSP Code Protection FeaturesPDF, 752 Kb, 档案已发布: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur - ESD Diode Current SpecificationPDF, 520 Kb, 档案已发布: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
模型线
系列: MSP430F5335 (4)
制造商分类
- Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x