Datasheet Texas Instruments MSP430F2274 — 数据表

制造商Texas Instruments
系列MSP430F2274
Datasheet Texas Instruments MSP430F2274

16位超低功耗微控制器,32KB闪存,1K RAM

数据表

MSP430F22x2, MSP430F22x4 Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, 修订版: G, 档案已发布: Aug 22, 2012
从文件中提取

价格

状态

MSP430F2274IDAMSP430F2274IDARMSP430F2274IRHARMSP430F2274IRHATMSP430F2274IYFFRMSP430F2274IYFFTMSP430F2274TDAMSP430F2274TDARMSP430F2274TRHARMSP430F2274TRHAT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesNoYesYesNoNoYesNoYes

打包

MSP430F2274IDAMSP430F2274IDARMSP430F2274IRHARMSP430F2274IRHATMSP430F2274IYFFRMSP430F2274IYFFTMSP430F2274TDAMSP430F2274TDARMSP430F2274TRHARMSP430F2274TRHAT
N12345678910
Pin38384040494938384040
Package TypeDADARHARHAYFFYFFDADARHARHA
Industry STD TermTSSOPTSSOPVQFNVQFNDSBGADSBGATSSOPTSSOPVQFNVQFN
JEDEC CodeR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-NR-XBGA-NR-XBGA-NR-PDSO-GR-PDSO-GS-PQFP-NS-PQFP-N
Package QTY402000250025025002504020002500250
CarrierTUBELARGE T&RLARGE T&RSMALL T&RLARGE T&RSMALL T&RTUBELARGE T&RLARGE T&RSMALL T&R
Device MarkingM430F2274M430F2274F2274F2274M430F2274M430F2274M430F2274TM430F2274TF2274TF2274T
Width (mm)6.26.2666.26.266
Length (mm)12.512.56612.512.566
Thickness (mm)1.151.15.9.9.425.4251.151.15.9.9
Pitch (mm).65.65.5.5.4.4.65.65.5.5
Max Height (mm)1.21.211.625.6251.21.211
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参数化

Parameters / ModelsMSP430F2274IDA
MSP430F2274IDA
MSP430F2274IDAR
MSP430F2274IDAR
MSP430F2274IRHAR
MSP430F2274IRHAR
MSP430F2274IRHAT
MSP430F2274IRHAT
MSP430F2274IYFFR
MSP430F2274IYFFR
MSP430F2274IYFFT
MSP430F2274IYFFT
MSP430F2274TDA
MSP430F2274TDA
MSP430F2274TDAR
MSP430F2274TDAR
MSP430F2274TRHAR
MSP430F2274TRHAR
MSP430F2274TRHAT
MSP430F2274TRHAT
ADCADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12chADC10 - 12ch
AESN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A
Active Power, uA/MHz270270270270270270270270270270
Additional FeaturesWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmpWatchdog,Temp Sensor,Brown Out Reset,OpAmp
BSLUARTUARTUARTUARTUARTUARTUARTUARTUARTUART
CPUMSP430MSP430MSP430MSP430MSP430MSP430MSP430MSP430MSP430MSP430
Frequency, MHz16161616161616161616
GPIO Pins32323232323232323232
I2C1111111111
Max VCC3.63.63.63.63.63.63.63.63.63.6
Min VCC1.81.81.81.81.81.81.81.81.81.8
MultiplierN/AN/AN/AN/AN/AN/AN/AN/AN/AN/A
Non-volatile Memory, KB32323232323232323232
Operating Temperature Range, C-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85-40 to 105,-40 to 85
Package GroupTSSOPTSSOPVQFNVQFNDSBGADSBGATSSOPTSSOPVQFNVQFN
Package Size: mm2:W x L, PKG38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)40VQFN: 36 mm2: 6 x 6(VQFN)40VQFN: 36 mm2: 6 x 6(VQFN)See datasheet (DSBGA)See datasheet (DSBGA)38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)40VQFN: 36 mm2: 6 x 6(VQFN)40VQFN: 36 mm2: 6 x 6(VQFN)
RAM, KB1111111111
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SPI1111111111
Special I/ON/AN/AN/AN/AN/AN/AN/AN/AN/AN/A
Standby Power, LPM3-uA0.70.70.70.70.70.70.70.70.70.7
Timers - 16-bit2222222222
UART1111111111
Wakeup Time, us1111111111

生态计划

MSP430F2274IDAMSP430F2274IDARMSP430F2274IRHARMSP430F2274IRHATMSP430F2274IYFFRMSP430F2274IYFFTMSP430F2274TDAMSP430F2274TDARMSP430F2274TRHARMSP430F2274TRHAT
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant

应用须知

  • Low-Power Battery-Less Wireless Temperature and Humidity Sensor for TMS37157
    PDF, 1.8 Mb, 档案已发布: Dec 19, 2011
    This application report describes a battery-less operation of a temperature and humidity sensor application. The implementation is done using the SHT21 relative humidity and temperature (RH&T) sensor from Sensirion (http://www.sensirion.com), an MSP430F2274 microcontroller, and the TMS37157 (PaLFI) low-frequency device from TI. The complete power for operating the wireless sensor and the MSP430F22
  • Using the SPI Library for TMS37157
    PDF, 68 Kb, 档案已发布: Dec 19, 2011
    This document describes the SPI Commands that are necessary to control the TMS37157 passive low-frequency interface (PaLFI) device and access its EEPROM. The functions of the SPI library are in C and can be easily called from any C program that includes the header files. The header files are optimized for the MSP430F2274 and can be easily adapted to other microcontrollers. The SPI library does not
  • Passive RFID Application Using MSP430F2274
    PDF, 2.5 Mb, 档案已发布: May 20, 2011
    This application report describes a reference design implementing a battery-less RFID application that includes an E-Paper display, using the PaLFI eZ430-TMS37157 RFID board. The sample application code is implemented to run on MSP430F2274 MCU. In addition to handling the communications and E-Paper display driving, the MCU also controls a DC-DC boost converter to supply the higher voltage required
  • Implementing IrDA with the MSP430 (Rev. A)
    PDF, 385 Kb, 修订版: A, 档案已发布: Jun 22, 2007
    The development of wireless communications has occurred rapidly throughout the past decade. One of the standards used is the Infrared Data Association (IrDA) specification. The protocol introduced by this entity consists of three basic layers: IrPHY, IrLAP, and IrLMP, which supply a base for many other applications. This application report implements the IrDA Lite protocol (IrPHY, IrLAP, and IrLMP
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Kb, 修订版: A, 档案已发布: Feb 16, 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Kb, 修订版: A, 档案已发布: Sep 13, 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)
    PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
    This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
  • Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)
    PDF, 179 Kb, 修订版: E, 档案已发布: Nov 3, 2016
    This application report enables easy migration from MSP430F2xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx family of FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two f
  • Random Number Generation Using the MSP430
    PDF, 39 Kb, 档案已发布: Oct 13, 2006
    Many applications require the generation of random numbers. These random numbers are useful for applications such as communication protocols, cryptography, and device individualization.Generating random numbers often requires the use of expensive dedicated hardware. Using the two independent clocks available on the MSP430F2xx family of devices, it is possible to generate random numbers without s
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • Interfacing TMS320C5000 DSP to MSP430 Mixed Signal Microcontroller (Rev. A)
    PDF, 82 Kb, 修订版: A, 档案已发布: Oct 13, 2000
    The TMS320C5000в„ў family of digital signal processors (DSPs) features Host Port Interface Controllers (HPI) and Direct Memory Access Controllers (DMAC) for efficient data movement without any CPU involvement. The HPI enables the DSP to interface to host processors (typically microcontrollers) bidirectionally with minimal or no external interface logic. This application report presents a hardw
  • MSP430 Capacitive Single-Touch Sensor Design Guide
    PDF, 770 Kb, 档案已发布: Jan 16, 2008
    This application report discusses the design of RC-type capacitive single-touch sensors using the MSP430 microcontroller. The MSP430 has some unique features that make it suitable for interfacing with capacitive-touch sensors. The RC-type method does not need special peripherals and can be implemented with all devices in the MSP430 product family. This method is also inherently low power and can
  • MSP430 Software Coding Techniques (Rev. A)
    PDF, 62 Kb, 修订版: A, 档案已发布: Jul 17, 2006
    This application report covers software techniques and topics of interest to all MSP430 programmers. The first part of the document discusses the MSP430 standard interrupt-based code flow model, recommended for the vast majority of applications. The next part discusses a handful of techniques that should be considered by any developer that sets out to develop an MSP430 application. Using these met
  • MSP430 Flash Memory Characteristics (Rev. A)
    PDF, 171 Kb, 修订版: A, 档案已发布: Apr 14, 2008
    Flash memory is a widely used, reliable, and flexible nonvolatile memory to store software code and data in a microcontroller. Failing to handle the flash according to data-sheet specifications may result in unreliable operation of the application. This application report explains the physics behind these specifications and also gives recommendations for correct MSP430 flash handling. All examples
  • Programming a Flash-Based MSP430 Using the JTAG Interface (Rev. H)
    PDF, 19 Kb, 修订版: H, 档案已发布: Jul 14, 2010
    This application report has been superseded by the document shown below. Information previously contained in this application report can be found by clicking on the following links.- MSP430 Programming Via the JTAG Interface User's Guide Download MSP430 Programming Via the JTAG Interface (PDF) Download
  • Tiny DCDC Converter Reference Design (Rev. A)
    PDF, 458 Kb, 修订版: A, 档案已发布: Jun 14, 2010
    This reference design is presented to help application designers and others who are trying to use the MSP430 in a system with an input voltage in the range of 3.6 V to 6 V with the primary design objective to minimize solution size as well as to maintain high efficiency and long battery life.
  • Understanding MSP430 Flash Data Retention
    PDF, 475 Kb, 档案已发布: Mar 27, 2008
    The MSP430 family of microcontrollers, as part of its broad portfolio, offers both read-only memory (ROM)-based and flash-based devices. Understanding the MSP430 flash is extremely important for efficient, robust, and reliable system design. Data retention is one of the key aspects to flash reliability. In this application report, data retention for the MSP430 flash is discussed in detail and the
  • Efficient MSP430 Code Synthesis for an FIR Filter
    PDF, 95 Kb, 档案已发布: Mar 29, 2007
    Digital filtering can be easily accomplished on the MSP430 using efficient multiplication. The tool accompanying this document automatically converts FIR filter coefficients to MSP430 assembly code that can be used in any application. Horner’s method and CSD format is used to accomplish the efficient multiply operations. The performance of the filter on the MSP430 is shown by evaluating the gain a
  • Boost DC/DC with Ultra-Low Shutdown Current (Rev. A)
    PDF, 121 Kb, 修订版: A, 档案已发布: Jun 14, 2010
    This reference design is presented to help application designers and others who are trying to use the MSP430 in a system that requires a very low input voltage range while also maintaining high efficiency. Battery life is extended as well as a result of the low quiescent current (5 mA) and ultra-low shutdown current (5 nA) of the TPS61097-33. This particular design allows for an input voltage betw
  • 1.8V – 5.5V Input, High-Efficiency DCDC Converter Reference Design for MSP430 (Rev. B)
    PDF, 961 Kb, 修订版: B, 档案已发布: Jun 14, 2010
    This reference design is presented to help application designers and others who are trying to use the MSP430 in a system with an input voltage in the range of 1.8 V to 5.5 V, and who must increase the application run time by making use of the complete battery voltage range while still maintaining high efficiency over the entire battery life.
  • MSP430 32-kHz Crystal Oscillators (Rev. D)
    PDF, 426 Kb, 修订版: D, 档案已发布: Jul 18, 2017
    Selection of the right crystal, correct load circuit, and proper board layout are important for a stable crystal oscillator. This application report summarizes crystal oscillator function and explains the parameters to select the correct crystal for ultra-low-power operation of an MSP430в„ў MCU. In addition, hints and examples for correct board layout are given. The document also contains detailed i
  • AES128 – A C Implementation for Encryption and Decryption (Rev. A)
    PDF, 460 Kb, 修订版: A, 档案已发布: Mar 17, 2009
    This application report describes the AES algorithm and the use of a suggested C implementation for AES encryption and decryption with MSP430.Note: This document may be subject to the export control policies of the local government.
  • Using the TPS3619 with MSP430 Microcontrollers Can Reduce Sys Power Consumption (Rev. A)
    PDF, 37 Kb, 修订版: A, 档案已发布: May 19, 2003
    The MSP430 series of microcontrollers are ideal in applications where battery life is critical. These microcontollers require only 0.1?A of current in low-power RAM retention mode; In this mode the microcontroller must have power to retain volatile memory. In some systems with charge pumps, the TPS3619 can be used to shut down the charge pump, saving system power consumption.
  • Advanced Debugging Using the Enhanced Emulation Module (EEM) With CCS v6 (Rev. F)
    PDF, 837 Kb, 修订版: F, 档案已发布: Sep 6, 2016
  • Powering the MSP430 from a High Voltage Input using the TPS62122 (Rev. C)
    PDF, 330 Kb, 修订版: C, 档案已发布: Jan 12, 2012
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Kb, 档案已发布: Oct 5, 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
  • ESD Diode Current Specification
    PDF, 520 Kb, 档案已发布: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
  • MSP Code Protection Features
    PDF, 752 Kb, 档案已发布: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur

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制造商分类

  • Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F2x/4x