Datasheet Texas Instruments CY29FCT818T — 数据表
| 制造商 | Texas Instruments |
| 系列 | CY29FCT818T |
诊断扫描寄存器
数据表
Diagnostic Scan Register With 3-State Outputs datasheet
PDF, 527 Kb, 修订版: B, 档案已发布: Nov 2, 2001
从文件中提取
价格
状态
| CY29FCT818CTSOCT | |
|---|---|
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| CY29FCT818CTSOCT | |
|---|---|
| N | 1 |
| Pin | 24 |
| Package Type | DW |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | 29FCT818C |
| Width (mm) | 7.5 |
| Length (mm) | 15.4 |
| Thickness (mm) | 2.35 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 2.65 |
| Mechanical Data | 下载 |
生态计划
| CY29FCT818CTSOCT | |
|---|---|
| RoHS | Compliant |
应用须知
- Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, 档案已发布: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
模型线
系列: CY29FCT818T (1)
制造商分类
- Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers