Datasheet Texas Instruments AM5726 — 数据表

制造商	Texas Instruments
系列	AM5726

数据表

价格

状态

打包

参数化

Parameters / Models	AM5726BABCX	AM5726BABCXA	AM5726BABCXAR	AM5726BABCXEA
ARM CPU	2 ARM Cortex-A15	2 ARM Cortex-A15	2 ARM Cortex-A15	2 ARM Cortex-A15
ARM MHz, Max.	1500	1500	1500	1500
ARM MIPS, Max.	10500	10500	10500	10500
Application	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
CAN	2	2	2	2
Co-Processor, s	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS
DMA, Ch	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA
DRAM	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L
DSP	2 C66x	2 C66x	2 C66x	2 C66x
DSP MHz, Max.	750	750	750	750
EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
I2C	5	5	5	5
IO Supply, V	1.8,3.3	1.8,3.3	1.8,3.3	1.8,3.3
Industrial Protocols	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
MMC/SD	4	4	4	4
McASP	8	8	8	8
On-Chip L1 Cache	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache	2MB (ARM Coxtex-A15)	2MB (ARM Coxtex-A15)	2MB (ARM Coxtex-A15)	2MB (ARM Coxtex-A15)
Operating Systems	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90	-40 to 105,0 to 90
Other Hardware Acceleration	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator
Other On-Chip Memory	2.5 MB w/ECC	2.5 MB w/ECC	2.5 MB w/ECC	2.5 MB w/ECC
PCI/PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe
PWM, Ch	3	3	3	3
Package Group	FCBGA	FCBGA	FCBGA	FCBGA
QSPI	1	1	1	1
RTC	1	1	1	1
Rating	Catalog	Catalog	Catalog	Catalog
SATA	1	1	1	1
SPI	4	4	4	4
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB
UART, SCI	10	10	10	10
USB	2	2	2	2
USB 2.0	1	1	1	1
USB 3.0	1	1	1	1
Video Port, Configurable	6+	6+	6+	6+
eCAP	3	3	3	3
eQEP	3	3	3	3

生态计划

应用须知

• 下载
  AM572x Thermal Considerations
  PDF, 400 Kb, 档案已发布: Dec 6, 2016
  This application report discusses thermal performance of the Sitara AM572x series processors. Data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across CPU loading and ambient temperature.
• 下载
  DSPLIB for Processor SDK RTOS
  PDF, 461 Kb, 档案已发布: Nov 4, 2016
• 下载
  AM572x GP EVM Power Simulations
  PDF, 22.4 Mb, 档案已发布: Oct 8, 2015
  The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
• 下载
  IODELAY Application Note for AM57xx Devices (Rev. A)
  PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
• 下载
  EMIF Tools (Rev. A)
  PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
  At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
• 下载
  AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
  PDF, 55 Kb, 档案已发布: Oct 6, 2016
  When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
• 下载
  Code Composer Studio Device Support Package
  PDF, 87 Kb, 档案已发布: Nov 19, 2015
  This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
• 下载
  AM572x/AM571x Compatibility Guide (Rev. C)
  PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
  This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
• 下载
  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
• 下载
  TI DSP Benchmarking
  PDF, 62 Kb, 档案已发布: Jan 13, 2016
  This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
• 下载
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
• 下载
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
• 下载
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x