Datasheet Texas Instruments AM5726 — 数据表

制造商Texas Instruments
系列AM5726
Datasheet Texas Instruments AM5726

Sitara处理器

数据表

AM572x Sitaraв„ў Processors Silicon Revision 2.0 datasheet
PDF, 4.6 Mb, 修订版: C, 档案已发布: Jun 6, 2017
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价格

状态

AM5726BABCXAM5726BABCXAAM5726BABCXARAM5726BABCXEA
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesNoYes

打包

AM5726BABCXAM5726BABCXAAM5726BABCXARAM5726BABCXEA
N1234
Pin760760760760
Package TypeABCABCABCABC
Industry STD TermFCBGAFCBGAFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY60602501
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)LARGE T&RJEDEC TRAY (5+1)
Device MarkingAM5726BABCXAM5726BABCXASITARATMSITARATM
Width (mm)23232323
Length (mm)23232323
Thickness (mm)2.392.392.392.39
Pitch (mm).8.8.8.8
Max Height (mm)2.962.962.962.96
Mechanical Data下载下载下载下载

参数化

Parameters / ModelsAM5726BABCX
AM5726BABCX
AM5726BABCXA
AM5726BABCXA
AM5726BABCXAR
AM5726BABCXAR
AM5726BABCXEA
AM5726BABCXEA
ARM CPU2 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A15
ARM MHz, Max.1500150015001500
ARM MIPS, Max.10500105001050010500
ApplicationCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal Electronics
CAN2222
Co-Processor, s2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS
DMA, Ch64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA
DRAMDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3L
DSP2 C66x2 C66x2 C66x2 C66x
DSP MHz, Max.750750750750
EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
I2C5555
IO Supply, V1.8,3.31.8,3.31.8,3.31.8,3.3
Industrial Protocols1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
MMC/SD4444
McASP8888
On-Chip L1 Cache32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache2MB (ARM Coxtex-A15)2MB (ARM Coxtex-A15)2MB (ARM Coxtex-A15)2MB (ARM Coxtex-A15)
Operating SystemsAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90
Other Hardware AccelerationCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto Accelerator
Other On-Chip Memory2.5 MB w/ECC2.5 MB w/ECC2.5 MB w/ECC2.5 MB w/ECC
PCI/PCIe2 PCIe2 PCIe2 PCIe2 PCIe
PWM, Ch3333
Package GroupFCBGAFCBGAFCBGAFCBGA
QSPI1111
RTC1111
RatingCatalogCatalogCatalogCatalog
SATA1111
SPI4444
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB
UART, SCI10101010
USB2222
USB 2.01111
USB 3.01111
Video Port, Configurable6+6+6+6+
eCAP3333
eQEP3333

生态计划

AM5726BABCXAM5726BABCXAAM5726BABCXARAM5726BABCXEA
RoHSCompliantCompliantCompliantCompliant

应用须知

  • AM572x Thermal Considerations
    PDF, 400 Kb, 档案已发布: Dec 6, 2016
    This application report discusses thermal performance of the Sitara AM572x series processors. Data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across CPU loading and ambient temperature.
  • DSPLIB for Processor SDK RTOS
    PDF, 461 Kb, 档案已发布: Nov 4, 2016
  • AM572x GP EVM Power Simulations
    PDF, 22.4 Mb, 档案已发布: Oct 8, 2015
    The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
  • IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
  • EMIF Tools (Rev. A)
    PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Kb, 档案已发布: Oct 6, 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • Code Composer Studio Device Support Package
    PDF, 87 Kb, 档案已发布: Nov 19, 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x