Datasheet Texas Instruments AM5718 — 数据表

制造商Texas Instruments
系列AM5718
Datasheet Texas Instruments AM5718

Sitara处理器

数据表

AM571x Sitara Processors Silicon Revision 2.0 datasheet
PDF, 4.2 Mb, 修订版: F, 档案已发布: Sep 11, 2017
从文件中提取

价格

状态

AM5718AABCXAM5718AABCXAAM5718AABCXEAAM5718AABCXEQ1AM5718AABCXQ1XAM5718AABCXEAXAM5718ABCXE
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesNoYesNoNoNo

打包

AM5718AABCXAM5718AABCXAAM5718AABCXEAAM5718AABCXEQ1AM5718AABCXQ1XAM5718AABCXEAXAM5718ABCXE
N1234567
Pin760760760760760760760
Package TypeABCABCABCABCABCABCABC
Industry STD TermFCBGAFCBGAFCBGAFCBGAFCBGAFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY6060606060
CarrierEIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingSITARATMSITARATMAM5718AABCXEAAM5718AABCXEQ1AM5718AABCXQ1XAM5718AABCXEAXAM5718ABCXE
Width (mm)23232323232323
Length (mm)23232323232323
Thickness (mm)2.392.392.392.392.392.392.39
Pitch (mm).8.8.8.8.8.8.8
Max Height (mm)2.962.962.962.962.962.962.96
Mechanical Data下载下载下载下载下载下载下载

参数化

Parameters / ModelsAM5718AABCX
AM5718AABCX
AM5718AABCXA
AM5718AABCXA
AM5718AABCXEA
AM5718AABCXEA
AM5718AABCXEQ1
AM5718AABCXEQ1
AM5718AABCXQ1
AM5718AABCXQ1
XAM5718AABCXEA
XAM5718AABCXEA
XAM5718ABCXE
XAM5718ABCXE
ARM CPU1 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A15
ARM MHz, Max.150015001500150015001500
ARM MHz (Max.)1500
ARM MIPS, Max.525052505250525052505250
ARM MIPS(Max.)5250
ApplicationCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
Approx. Price (US$)30.05 | 1ku
CAN222222
CAN(#)2
CSI-22222222
Co-Processor, s2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)2 ARM Cortex-M4
4 PRU-ICSS
DMA, Ch64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA
DMA(Ch)64-Ch EDMA
DRAMDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3(L)DDR3,DDR3L
DSP1 C66x1 C66x1 C66x1 C66x1 C66x1 C66x1 C66x
DSP MHz, Max.750750750750750750
DSP MHz (Max.)750
Display Options1 HDMI out,3 LCD out1 HDMI out,3 LCD out1 HDMI out,3 LCD out1 HDMI out,3 LCD out1 HDMI out,3 LCD out1 HDMI out
3 LCD out
1 HDMI out,3 LCD out
EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000
2-Port 1Gb Switch
10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC
NAND flash
NOR Flash
SRAM)
1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
Graphics Acceleration1 3D,1 2D1 3D,1 2D1 3D,1 2D1 3D,1 2D1 3D,1 2D1 3D
1 2D
1 3D,1 2D
HDMI1111111
I2C5555555
IO Supply, V1.8,3.31.8,3.31.8,3.31.8,3.31.8,3.31.8,3.3
IO Supply(V)1.8
3.3
Industrial Protocols1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588
EtherCAT
EtherNet/IP
POWERLINK
PROFIBUS
PROFINET RT/IRT
SERCOS III
1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
LCD3333333
MMC/SD4444444
McASP8888888
On-Chip L1 Cache32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32 KB (ARM Cortex-A15)
32 KB (C66x)
32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15)
288 KB (C66x)
1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)
Operating SystemsAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid
Integrity
Linux
Nucleus
Neutrino
TI-RTOS
VxWorks
Windows Embedded CE
Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90
Operating Temperature Range(C)-40 to 105
0 to 90
Other Hardware AccelerationCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto Accelerator
Other On-Chip Memory512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC
PCI/PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe
PWM, Ch333333
PWM(Ch)3
Package GroupFCBGAFCBGAFCBGAFCBGAFCBGAFCBGAFCBGA
QSPI1111111
RTC1111111
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SATA1111111
SPI4444444
Security EnablerCryptographic Acceleration
Debug Security
Device Identity
External Memory Protection
Initial Secure Programming
Physical Security
Secure Boot
Secure Storage
Software IP Protection
Trusted Execution Environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN
I2C
SPI
UART
USB
CAN,I2C,SPI,UART,USB
UART, SCI101010101010
UART(SCI)10
USB2222222
USB 2.01111111
USB 3.01111111
Video Port, Configurable6+6+6+6+6+6+
Video Port (Configurable)6+
Video Resolution/Frame Rate1080p601080p601080p601080p601080p601080p601080p60
eCAP3333333
eQEP3333333

生态计划

AM5718AABCXAM5718AABCXAAM5718AABCXEAAM5718AABCXEQ1AM5718AABCXQ1XAM5718AABCXEAXAM5718ABCXE
RoHSCompliantCompliantCompliantCompliantCompliantCompliantNot Compliant
Pb FreeYes

应用须知

  • DSPLIB for Processor SDK RTOS
    PDF, 461 Kb, 档案已发布: Nov 4, 2016
  • AM572x GP EVM Power Simulations
    PDF, 22.4 Mb, 档案已发布: Oct 8, 2015
    The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
  • IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
  • Code Composer Studio Device Support Package
    PDF, 87 Kb, 档案已发布: Nov 19, 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Kb, 档案已发布: Oct 6, 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • EMIF Tools (Rev. A)
    PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • Keystone EDMA FAQ
    PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x