Datasheet Texas Instruments AM5716 — 数据表

制造商Texas Instruments
系列AM5716
Datasheet Texas Instruments AM5716

Sitara处理器

数据表

AM571x Sitara Processors Silicon Revision 2.0 datasheet
PDF, 4.2 Mb, 修订版: F, 档案已发布: Sep 11, 2017
从文件中提取

价格

状态

AM5716AABCDAM5716AABCDAAM5716AABCDEAAM5716AABCXAM5716AABCXAAM5716AABCXEAAM5716AABCXEQ1AM5716AABCXQ1
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesYesYesYesYesNoNo

打包

AM5716AABCDAM5716AABCDAAM5716AABCDEAAM5716AABCXAM5716AABCXAAM5716AABCXEAAM5716AABCXEQ1AM5716AABCXQ1
N12345678
Pin760760760760760760760760
Package TypeABCABCABCABCABCABCABCABC
Industry STD TermFCBGAFCBGAFCBGAFCBGAFCBGAFCBGAFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY6060606060606060
CarrierEIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)EIAJ TRAY (5+1)
Device MarkingAM5716AABCDAM5716AABCDASITARATMSITARATMAM5716AABCXAAM5716AABCXEAAM5716AABCXEQ1AM5716AABCXQ1
Width (mm)2323232323232323
Length (mm)2323232323232323
Thickness (mm)2.392.392.392.392.392.392.392.39
Pitch (mm).8.8.8.8.8.8.8.8
Max Height (mm)2.962.962.962.962.962.962.962.96
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参数化

Parameters / ModelsAM5716AABCD
AM5716AABCD
AM5716AABCDA
AM5716AABCDA
AM5716AABCDEA
AM5716AABCDEA
AM5716AABCX
AM5716AABCX
AM5716AABCXA
AM5716AABCXA
AM5716AABCXEA
AM5716AABCXEA
AM5716AABCXEQ1
AM5716AABCXEQ1
AM5716AABCXQ1
AM5716AABCXQ1
ARM CPU1 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A151 ARM Cortex-A15
ARM MHz, Max.500,1500500,1500500,1500500,1500500,1500500,1500500,1500500,1500
ARM MIPS, Max.1750,52501750,52501750,52501750,52501750,52501750,52501750,52501750,5250
ApplicationCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal Electronics
CAN22222222
CSI-222222222
Co-Processor, s2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS
DMA, Ch64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA64-Ch EDMA
DRAMDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3,DDR3L
DSP1 C66x1 C66x1 C66x1 C66x1 C66x1 C66x1 C66x1 C66x
DSP MHz, Max.500,750500,750500,750500,750500,750500,750500,750500,750
EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
I2C55555555
IO Supply, V1.8,3.31.8,3.31.8,3.31.8,3.31.8,3.31.8,3.31.8,3.31.8,3.3
Industrial Protocols1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
MMC/SD44444444
McASP88888888
On-Chip L1 Cache32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)
Operating SystemsAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90-40 to 105,-40 to 125,0 to 90
Other Hardware AccelerationCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto Accelerator
Other On-Chip Memory512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC512 KB w/ECC
PCI/PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe2 PCIe
PWM, Ch33333333
Package GroupFCBGAFCBGAFCBGAFCBGAFCBGAFCBGAFCBGAFCBGA
QSPI11111111
RTC11111111
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
SATA11111111
SPI44444444
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB
UART, SCI1010101010101010
USB22222222
USB 2.011111111
USB 3.011111111
Video Port, Configurable6+6+6+6+6+6+6+6+
eCAP33333333
eQEP33333333

生态计划

AM5716AABCDAM5716AABCDAAM5716AABCDEAAM5716AABCXAM5716AABCXAAM5716AABCXEAAM5716AABCXEQ1AM5716AABCXQ1
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant

应用须知

  • AM572x GP EVM Power Simulations
    PDF, 22.4 Mb, 档案已发布: Oct 8, 2015
    The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
  • IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
  • EMIF Tools (Rev. A)
    PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • Code Composer Studio Device Support Package
    PDF, 87 Kb, 档案已发布: Nov 19, 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Kb, 档案已发布: Oct 6, 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x