Datasheet Texas Instruments AM4378 — 数据表

制造商Texas Instruments
系列AM4378
Datasheet Texas Instruments AM4378

Sitara处理器

数据表

AM437x Sitaraв„ў Processors datasheet
PDF, 3.0 Mb, 修订版: D, 档案已发布: Sep 14, 2016
从文件中提取

价格

状态

AM4378BZDN100AM4378BZDN80AM4378BZDNA100AM4378BZDNA80AM4378BZDND100AM4378BZDND80
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesYesYesYesYes

打包

AM4378BZDN100AM4378BZDN80AM4378BZDNA100AM4378BZDNA80AM4378BZDND100AM4378BZDND80
N123456
Pin491491491491491491
Package TypeZDNZDNZDNZDNZDNZDN
Package QTY909090909090
Device MarkingAM4378BZDN100AM4378BZDN80AM4378BZDNA100AM4378BZDNA80AM4378BZDND100AM4378BZDND80
Width (mm)171717171717
Length (mm)171717171717
Thickness (mm).9.9.9.9.9.9
Mechanical Data下载下载下载下载下载下载

参数化

Parameters / ModelsAM4378BZDN100
AM4378BZDN100
AM4378BZDN80
AM4378BZDN80
AM4378BZDNA100
AM4378BZDNA100
AM4378BZDNA80
AM4378BZDNA80
AM4378BZDND100
AM4378BZDND100
AM4378BZDND80
AM4378BZDND80
ARM CPU1 ARM Cortex-A91 ARM Cortex-A91 ARM Cortex-A91 ARM Cortex-A91 ARM Cortex-A91 ARM Cortex-A9
ARM MHz, Max.800,1000800,1000800,1000800,1000800,1000800,1000
ApplicationsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal Electronics
Co-Processor, s4 PRU-ICSS4 PRU-ICSS4 PRU-ICSS4 PRU-ICSS4 PRU-ICSS4 PRU-ICSS
DMIPS2000,25002000,25002000,25002000,25002000,25002000,2500
DRAMDDR3,DDR3L,LPDDR2DDR3,DDR3L,LPDDR2DDR3,DDR3L,LPDDR2DDR3,DDR3L,LPDDR2DDR3,DDR3L,LPDDR2DDR3,DDR3L,LPDDR2
Display Outputs111111
EMAC2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Graphics Acceleration1 3D1 3D1 3D1 3D1 3D1 3D
Industrial Protocols1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter
On-Chip L2 Cache256 KB (ARM Cortex-A9)256 KB (ARM Cortex-A9)256 KB (ARM Cortex-A9)256 KB (ARM Cortex-A9)256 KB (ARM Cortex-A9)256 KB (ARM Cortex-A9)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90
Other On-Chip Memory320 KB320 KB320 KB320 KB320 KB320 KB
RatingCatalogCatalogCatalogCatalogCatalogCatalog
Security EnablerCryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB
Video Input Ports111111

生态计划

AM4378BZDN100AM4378BZDN80AM4378BZDNA100AM4378BZDNA80AM4378BZDND100AM4378BZDND80
RoHSCompliantCompliantCompliantCompliantCompliantCompliant

应用须知

  • Sitara AM437x DDR-Less System How-To Instructions and Benchmarks (Rev. A)
    PDF, 252 Kb, 修订版: A, 档案已发布: Feb 21, 2017
    This application report describes a system running EtherCAT slave with motor control leveraging the rich feature set of the Texas Instruments Sitara AM437x processor. The application on the Sitara AM437x Industrial Development Kit (IDK) EVM is demonstrated by utilizing internal SRAM, QSPI memory and eliminating external DDR completely. Benchmarking data is presented and shows no impact of the syst
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A9> AM437x