Datasheet Texas Instruments AM3356 — 数据表

制造商Texas Instruments
系列AM3356
Datasheet Texas Instruments AM3356

Sitara处理器

数据表

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Mb, 修订版: J, 档案已发布: Apr 12, 2016
从文件中提取

价格

状态

AM3356BZCEA60AM3356BZCZ30AM3356BZCZ60AM3356BZCZ80AM3356BZCZA30AM3356BZCZA60AM3356BZCZA80AM3356BZCZD30AM3356BZCZD60
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesNoYesYesYesYesYesYes

打包

AM3356BZCEA60AM3356BZCZ30AM3356BZCZ60AM3356BZCZ80AM3356BZCZA30AM3356BZCZA60AM3356BZCZA80AM3356BZCZD30AM3356BZCZD60
N123456789
Pin298324324324324324324324324
Package TypeZCEZCZZCZZCZZCZZCZZCZZCZZCZ
Industry STD TermNFBGA
JEDEC CodeS-PBGA-N
Package QTY160126126126126126126126126
Device MarkingAM3356BZCEA60AM3356BZCZ30AM3356BZCZ60AM3356BZCZ80AM3356BZCZA30AM3356BZCZA60AM3356BZCZA80AM3356BZCZD30AM3356BZCZD60
Width (mm)131515151515151515
Length (mm)131515151515151515
Thickness (mm).89.9.9.9.9.9.9.9.9
Pitch (mm).65
Max Height (mm)1.3
Mechanical Data下载下载下载下载下载下载下载下载下载
CarrierJEDEC TRAY (10+1)

参数化

Parameters / ModelsAM3356BZCEA60
AM3356BZCEA60
AM3356BZCZ30
AM3356BZCZ30
AM3356BZCZ60
AM3356BZCZ60
AM3356BZCZ80
AM3356BZCZ80
AM3356BZCZA30
AM3356BZCZA30
AM3356BZCZA60
AM3356BZCZA60
AM3356BZCZA80
AM3356BZCZA80
AM3356BZCZD30
AM3356BZCZD30
AM3356BZCZD60
AM3356BZCZD60
ARM CPU1 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A81 ARM Cortex-A8
ARM MHz, Max.300,600,800300,600,800300,600,800300,600,800300,600,800300,600,800300,600,800300,600,800300,600,800
ApplicationsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal ElectronicsAutomotive,Industrial,Personal Electronics
Co-Processor, s2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS2 PRU-ICSS
DMIPS600,1200,1600600,1200,1600600,1200,1600600,1200,1600600,1200,1600600,1200,1600600,1200,1600600,1200,1600600,1200,1600
DRAMDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDRDDR2,DDR3,DDR3L,LPDDR
Display Outputs111111111
EMAC2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Industrial Protocols1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherNet/IP,PROFIBUS,PROFINET RT/IRT,SERCOS III
On-Chip L2 Cache256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90-40 to 105,-40 to 90,0 to 90
Other On-Chip Memory128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB128 KB
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environmentCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USB

生态计划

AM3356BZCEA60AM3356BZCZ30AM3356BZCZ60AM3356BZCZ80AM3356BZCZA30AM3356BZCZA60AM3356BZCZA80AM3356BZCZD30AM3356BZCZD60
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliantCompliant

应用须知

  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Kb, 修订版: A, 档案已发布: Feb 28, 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Kb, 修订版: A, 档案已发布: Apr 27, 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
    PDF, 76 Kb, 修订版: A, 档案已发布: Aug 21, 2014
    This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Kb, 档案已发布: Mar 4, 2016
  • AM335x Thermal Considerations
    PDF, 16 Kb, 档案已发布: Apr 15, 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x