Datasheet Texas Instruments AM3354 — 数据表

制造商	Texas Instruments
系列	AM3354

Sitara处理器

数据表

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PDF, 3.2 Mb, 修订版: J, 档案已发布: Apr 12, 2016

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状态

	AM3354BZCE60	AM3354BZCEA60	AM3354BZCED60	AM3354BZCZ100	AM3354BZCZ30	AM3354BZCZ60	AM3354BZCZ80	AM3354BZCZA100	AM3354BZCZA60	AM3354BZCZA80	AM3354BZCZA80R	AM3354BZCZD60	AM3354BZCZD80
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes	No	Yes	No	No	No	Yes	No	Yes	Yes	No	Yes	Yes

打包

	AM3354BZCE60	AM3354BZCEA60	AM3354BZCED60	AM3354BZCZ100	AM3354BZCZ30	AM3354BZCZ60	AM3354BZCZ80	AM3354BZCZA100	AM3354BZCZA60	AM3354BZCZA80	AM3354BZCZA80R	AM3354BZCZD60	AM3354BZCZD80
N	1	2	3	4	5	6	7	8	9	10	11	12	13
Pin	298	298	298	324	324	324	324	324	324	324	324	324	324
Package Type	ZCE	ZCE	ZCE	ZCZ	ZCZ	ZCZ	ZCZ	ZCZ	ZCZ	ZCZ	ZCZ	ZCZ	ZCZ
Industry STD Term	NFBGA	NFBGA	NFBGA
JEDEC Code	S-PBGA-N	S-PBGA-N	S-PBGA-N
Package QTY	160	160	160	126	126	126	126	126	126	126	1000	126	126
Device Marking	AM3354BZCE60	AM3354BZCEA60	AM3354BZCED60	AM3354BZCZ100	AM3354BZCZ30	AM3354BZCZ60	AM3354BZCZ80	AM3354BZCZA100	AM3354BZCZA60	AM3354BZCZA80	AM3354BZCZA80	AM3354BZCZD60	AM3354BZCZD80
Width (mm)	13	13	13	15	15	15	15	15	15	15	15	15	15
Length (mm)	13	13	13	15	15	15	15	15	15	15	15	15	15
Thickness (mm)	.89	.89	.89	.9	.9	.9	.9	.9	.9	.9	.9	.9	.9
Pitch (mm)	.65	.65	.65
Max Height (mm)	1.3	1.3	1.3
Mechanical Data	下载	下载	下载	下载	下载	下载	下载	下载	下载	下载	下载	下载	下载
Carrier		JEDEC TRAY (10+1)

参数化

Parameters / Models	AM3354BZCE60	AM3354BZCEA60	AM3354BZCED60	AM3354BZCZ100	AM3354BZCZ30	AM3354BZCZ60	AM3354BZCZ80	AM3354BZCZA100	AM3354BZCZA60	AM3354BZCZA80	AM3354BZCZA80R	AM3354BZCZD60	AM3354BZCZD80
ARM CPU	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8
ARM MHz, Max.	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000	600,800,1000
Applications	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics	Automotive,Industrial,Personal Electronics
Co-Processor, s	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
DMIPS	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000	1200,1600,2000
DRAM	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR	DDR2,DDR3,DDR3L,LPDDR
Display Outputs	1	1	1	1	1	1	1	1	1	1	1	1	1
EMAC	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch	2-Port 1Gb Switch
Graphics Acceleration	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D
On-Chip L2 Cache	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)
Operating Systems	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90
Other On-Chip Memory	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB	128 KB
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Security Enabler	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB

生态计划

	AM3354BZCE60	AM3354BZCEA60	AM3354BZCED60	AM3354BZCZ100	AM3354BZCZ30	AM3354BZCZ60	AM3354BZCZ80	AM3354BZCZA100	AM3354BZCZA60	AM3354BZCZA80	AM3354BZCZA80R	AM3354BZCZD60	AM3354BZCZD80
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant	Compliant

应用须知

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AM335x Low Power Design Guide (Rev. A)
PDF, 300 Kb, 修订版: A, 档案已发布: Feb 28, 2017
This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developerвЂ™s application runs in that system under specific conditions.
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AM335x Reliability Considerations in PLC Applications (Rev. A)
PDF, 112 Kb, 修订版: A, 档案已发布: Apr 27, 2017
Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
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AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
PDF, 76 Kb, 修订版: A, 档案已发布: Aug 21, 2014
This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
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Processor SDK RTOS Customization: Modifying Board library to change UART instanc
PDF, 783 Kb, 档案已发布: Mar 4, 2016
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AM335x Thermal Considerations
PDF, 16 Kb, 档案已发布: Apr 15, 2013
This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
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nFBGA Packaging (Rev. B)
PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
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0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
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Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as вЂњprocessorsвЂќ, вЂњSystem-on-chipвЂќ, or вЂњSoCвЂќ). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
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High-Speed Interface Layout Guidelines (Rev. G)
PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

系列: AM3354 (13)

AM3354BZCE60 AM3354BZCEA60 AM3354BZCED60 AM3354BZCZ100 AM3354BZCZ30 AM3354BZCZ60 AM3354BZCZ80 AM3354BZCZA100 AM3354BZCZA60 AM3354BZCZA80 AM3354BZCZA80R AM3354BZCZD60 AM3354BZCZD80

制造商分类

Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM335x