Datasheet Texas Instruments AM3352BZCED30 — 数据表

制造商Texas Instruments
系列AM3352
零件号AM3352BZCED30
Datasheet Texas Instruments AM3352BZCED30

Sitara处理器:ARM Cortex-A8、1 Gb以太网,显示298-NFBGA -40至90

数据表

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Mb, 修订版: J, 档案已发布: Apr 12, 2016
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin298
Package TypeZCE
Industry STD TermNFBGA
JEDEC CodeS-PBGA-N
Package QTY160
Device MarkingAM3352BZCED30
Width (mm)13
Length (mm)13
Thickness (mm).89
Pitch (mm).65
Max Height (mm)1.3
Mechanical Data下载

参数化

ARM CPU1 ARM Cortex-A8
ARM MHz300,600,800,1000 Max.
ApplicationsAutomotive,Industrial,Personal Electronics
Co-ProcessorN/A s
DMIPS600,1200,1600,2000
DRAMDDR2,DDR3,DDR3L,LPDDR
Display Outputs1
EMAC2-Port 1Gb Switch
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Linux,Windows Embedded CE
Operating Temperature Range-40 to 125,-40 to 90,-40 to 105,0 to 90,to C
Other On-Chip Memory128 KB
RatingCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USB

生态计划

RoHSCompliant

设计套件和评估模块

  • Daughter Cards: WL1835MODCOM8B
    WiLinkВ™ 8 Module 2.4 GHz WiFiВ® + BluetoothВ® COM8 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Daughter Cards: WL1837MODCOM8I
    WiLinkВ™ 8 Dual Band 2.4 & 5 GHz Wi-FiВ® + BluetoothВ® COM8 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSSK3358
    AM335x Starter Kit
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BEAGLEBK
    BeagleBone Black Development Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDXEVM3358
    AM335x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • AM335x Power Estimation Tool
    PDF, 84 Kb, 档案已发布: May 31, 2017
    The Power Estimation ToolPower Estimation Tool (PET) allows you to gain insight into the power consumption of select Sitara processors. The tool includes the ability for you to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be applied to further reduce overall power consumption.
  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Kb, 修订版: A, 档案已发布: Feb 28, 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x and AM43xx Sitara Processors USB Layout Guidelines (Rev. A)
    PDF, 76 Kb, 修订版: A, 档案已发布: Aug 21, 2014
    This application report discusses best-practice layout guidelines when implementing a universal serial bus (USB).
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Kb, 档案已发布: Mar 4, 2016
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Kb, 修订版: A, 档案已发布: Apr 27, 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • AM335x Thermal Considerations
    PDF, 16 Kb, 档案已发布: Apr 15, 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • Sitara Linux ALSA DSP Microphone Array Voice Recognition
    PDF, 529 Kb, 档案已发布: Jun 30, 2017
    Voice recognition applications requiring a superior user experience typically use a number of digital signal processing algorithms to filter, clean, and enhance microphone sampled audio. Frequently these systems will employ multiple microphones where more sophisticated algorithms can be used. These systems can leverage a Texas Instruments Digital Signal Processor to offload the complex real-time c
  • PRU-ICSS Migration Guide: AM335x to AM437x
    PDF, 59 Kb, 档案已发布: Apr 7, 2017
    This migration guide details the Programmable Real-Time Unit (PRU) subsystem hardware differences and outlines software modifications required for porting PRU firmware and ARMВ® code to AM437x.
  • PRU-ICSS Migration Guide: AM335x to AM57x (Rev. A)
    PDF, 71 Kb, 修订版: A, 档案已发布: Jul 13, 2017
    This software migration guide assists in porting legacy software developed for the Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-CSS) on AM335x to AM57x platforms.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
  • Processor-SDK RTOS Power Management and Measurement
    PDF, 78 Kb, 档案已发布: Aug 2, 2017
    Processor-SDK RTOS provides out-of-the-box power management examples that empower customers to tailor Sitara processors’ (ARM and DSP) power-performance points per use case. You can configure all supported operating points and run CPU Idle and Dhrystone benchmarking workloads while employing a minimal kernel with real-time assurance. This application report provides an overview of the Processor-SD
  • PRU-ICSS Feature Comparison
    PDF, 29 Kb, 档案已发布: Jun 5, 2017
    This application report documents the feature differences between the PRU subsystems available on different TI processors.
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM335x