Datasheet Texas Instruments 74ACT11004 — 数据表

制造商Texas Instruments
系列74ACT11004
Datasheet Texas Instruments 74ACT11004

六角逆变器

数据表

Hex Inverter datasheet
PDF, 560 Kb, 修订版: B, 档案已发布: Jun 1, 1997
从文件中提取

价格

状态

74ACT11004DBLE74ACT11004DBR74ACT11004DW74ACT11004DWG474ACT11004DWR74ACT11004DWRE474ACT11004DWRG474ACT11004N74ACT11004PW74ACT11004PWG4
Lifecycle StatusObsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Obsolete (Manufacturer has discontinued the production of the device)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNoNo

打包

74ACT11004DBLE74ACT11004DBR74ACT11004DW74ACT11004DWG474ACT11004DWR74ACT11004DWRE474ACT11004DWRG474ACT11004N74ACT11004PW74ACT11004PWG4
N12345678910
Pin20202020202020202020
Package TypeDBDBDWDWDWDWDWNPWPW
Industry STD TermSSOPSSOPSOICSOICSOICSOICSOICPDIPTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDIP-TR-PDSO-GR-PDSO-G
Width (mm)5.35.37.57.57.57.57.56.354.44.4
Length (mm)7.27.212.812.812.812.812.824.336.56.5
Thickness (mm)1.951.952.352.352.352.352.354.5711
Pitch (mm).65.651.271.271.271.271.272.54.65.65
Max Height (mm)222.652.652.652.652.655.081.21.2
Mechanical Data下载下载下载下载下载下载下载下载下载下载
Package QTY20002525207070
CarrierLARGE T&RTUBETUBETUBETUBETUBE
Device MarkingAT004ACT11004ACT1100474ACT11004NAT004AT004

参数化

Parameters / Models74ACT11004DBLE
74ACT11004DBLE
74ACT11004DBR
74ACT11004DBR
74ACT11004DW
74ACT11004DW
74ACT11004DWG4
74ACT11004DWG4
74ACT11004DWR
74ACT11004DWR
74ACT11004DWRE4
74ACT11004DWRE4
74ACT11004DWRG4
74ACT11004DWRG4
74ACT11004N
74ACT11004N
74ACT11004PW
74ACT11004PW
74ACT11004PWG4
74ACT11004PWG4
Approx. Price (US$)0.94 | 1ku0.94 | 1ku0.94 | 1ku0.94 | 1ku0.94 | 1ku
Bits66666
Bits(#)66666
F @ Nom Voltage(Max), Mhz9090909090
F @ Nom Voltage(Max)(Mhz)9090909090
ICC @ Nom Voltage(Max), mA0.040.040.040.040.04
ICC @ Nom Voltage(Max)(mA)0.040.040.040.040.04
Input TypeTTLTTLTTLTTL
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Operating Temperature Range(C)-40 to 85-40 to 85-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA-24/24-24/24-24/24-24/24-24/24
Output Drive (IOL/IOH)(Max)(mA)-24/24-24/24-24/24-24/24-24/24
Output TypeCMOSCMOSCMOSCMOS
Package GroupSSOPSSOPSOICSOICSOICSOICSOICPDIPTSSOPTSSOP
Package Size: mm2:W x L, PKG20SOIC: 132 mm2: 10.3 x 12.8(SOIC)20SOIC: 132 mm2: 10.3 x 12.8(SOIC)See datasheet (PDIP)20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
Package Size: mm2:W x L (PKG)See datasheet (PDIP)See datasheet (PDIP)See datasheet (PDIP)See datasheet (PDIP)See datasheet (PDIP)
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Schmitt TriggerNoNoNoNoNoNoNoNoNoNo
Technology FamilyACTACTACTACTACTACTACTACTACTACT
VCC(Max), V5.55.55.55.55.5
VCC(Max)(V)5.55.55.55.55.5
VCC(Min), V4.54.54.54.54.5
VCC(Min)(V)4.54.54.54.54.5
Voltage(Nom), V55555
Voltage(Nom)(V)55555
tpd @ Nom Voltage(Max), ns9.79.79.79.79.7
tpd @ Nom Voltage(Max)(ns)9.79.79.79.79.7

生态计划

74ACT11004DBLE74ACT11004DBR74ACT11004DW74ACT11004DWG474ACT11004DWR74ACT11004DWRE474ACT11004DWRG474ACT11004N74ACT11004PW74ACT11004PWG4
RoHSNot CompliantCompliantCompliantCompliantNot CompliantNot CompliantNot CompliantCompliantCompliantCompliant
Pb FreeYesNoNoNoNoYes

应用须知

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    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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    PDF, 93 Kb, 档案已发布: Apr 30, 2015
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    PDF, 1.3 Mb, 档案已发布: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, 档案已发布: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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制造商分类

  • Semiconductors> Logic> Buffer/Driver/Transceiver> Inverting Buffer/Driver