Datasheet Texas Instruments TS3USB3200RSVR — 数据表

制造商Texas Instruments
系列TS3USB3200
零件号TS3USB3200RSVR
Datasheet Texas Instruments TS3USB3200RSVR

带ID选择和灵活电源控制的USB 2.0高速和移动高清链接开关16-UQFN -40至85

数据表

TS3USB3200 SPDT USB 2.0 High-Speed (480 Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch With additional SPDT ID Select Switch and Flexible Power Control datasheet
PDF, 1.3 Mb, 修订版: B, 档案已发布: Jul 11, 2016
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin16
Package TypeRSV
Industry STD TermUQFN
JEDEC CodeR-PQFP-N
Package QTY3000
CarrierLARGE T&R
Device MarkingZTO
Width (mm)1.8
Length (mm)2.6
Thickness (mm).5
Pitch (mm).4
Max Height (mm).55
Mechanical Data下载

参数化

Additional FeaturesUSB 2.0,Mobile High-Definition Link (MHL),Over-Voltage Tolerance (OVT),Current Leakage Protection,Flexible Power Control,Logic Controlled (Output Enabled)
Bandwidth5500 MHz
Configuration2:1 SPDT
Device TypeUSB/MHL Switch
ESD HBM(Typ)3.5 kV
ICC(Max)70 uA
ICC(Typ)40 uA
Input/Ouput Voltage(Max)3.6 V
Number of Channels2
Operating Temperature Range-40 to 85 C
Package GroupUQFN
Package Size: mm2:W x L16UQFN: 5 mm2: 1.8 x 2.6(UQFN) PKG
RatingCatalog
Ron(Typ)4.6 Ohms
VCC(Max)4.3 V
VCC(Min)2.7 V

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: TS3USB3200EVM
    TS3USB3200EVM: USB 2.0 High-Speed and Mobile High-Definition Link Switch Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

系列: TS3USB3200 (2)

制造商分类

  • Semiconductors > Interface > USB > USB Retimers, Redrivers and USB/MHL Switches