Datasheet Texas Instruments TMP007AIYZFR — 数据表
| 制造商 | Texas Instruments |
| 系列 | TMP007 |
| 零件号 | TMP007AIYZFR |
带有WCSP封装的集成数学引擎的红外热电堆非接触式温度传感器8-DSBGA -40至125
数据表
TMP007 Infrared Thermopile Sensor with Integrated Math Engine datasheet
PDF, 1.3 Mb, 修订版: C, 档案已发布: Jul 28, 2015
应用须知
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, 档案已发布: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, 修订版: AG, 档案已发布: Aug 12, 2015
- Understanding the I2C BusPDF, 124 Kb, 档案已发布: Jun 30, 2015
模型线
系列: TMP007 (2)
- TMP007AIYZFR TMP007AIYZFT
制造商分类
- Semiconductors > Sensing Products > Temperature Sensors > Cable & Probe Temperature Sensors