Datasheet Texas Instruments 74AC16245DL — 数据表

制造商Texas Instruments
系列74AC16245
零件号74AC16245DL
Datasheet Texas Instruments 74AC16245DL

具有三态输出的16位总线收发器48-SSOP -40至85

数据表

16-Bit Bus Transceivers With 3-State Outputs datasheet
PDF, 312 Kb, 修订版: A, 档案已发布: Apr 1, 1996
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin48
Package TypeDL
Industry STD TermSSOP
JEDEC CodeR-PDSO-G
Package QTY25
CarrierTUBE
Device MarkingAC16245
Width (mm)7.49
Length (mm)15.88
Thickness (mm)2.59
Pitch (mm).635
Max Height (mm)2.79
Mechanical Data下载

参数化

Bits16
F @ Nom Voltage(Max)100 Mhz
ICC @ Nom Voltage(Max)0.08 mA
Operating Temperature Range-40 to 85 C
Output Drive (IOL/IOH)(Max)-24/24 mA
Package GroupSSOP
Package Size: mm2:W x L48SSOP: 164 mm2: 10.35 x 15.88(SSOP) PKG
RatingCatalog
Schmitt TriggerNo
Technology FamilyAC
VCC(Max)5.5 V
VCC(Min)3 V
Voltage(Nom)3.3,5 V
tpd @ Nom Voltage(Max)13.5,8.9 ns

生态计划

RoHSCompliant

应用须知

  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
  • Live Insertion
    PDF, 150 Kb, 档案已发布: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, 档案已发布: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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制造商分类

  • Semiconductors > Logic > Buffer/Driver/Transceiver > Standard Transceiver