Datasheet Texas Instruments TLV2374MDREP — 数据表

制造商Texas Instruments
系列TLV2374-EP
零件号TLV2374MDREP
Datasheet Texas Instruments TLV2374MDREP

增强型产品550-Ua / Ch 3-Mhz轨至轨输入/输出运算放大器14-SOIC -55至125

数据表

Family of 550-microampere A/Ch 3-MHz Rail-to-Rail Input/Output Op Amps datasheet
PDF, 608 Kb, 修订版: A, 档案已发布: Apr 5, 2006
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin14
Package TypeD
Industry STD TermSOIC
JEDEC CodeR-PDSO-G
Package QTY2500
CarrierLARGE T&R
Device MarkingTLV2374EP
Width (mm)3.91
Length (mm)8.65
Thickness (mm)1.58
Pitch (mm)1.27
Max Height (mm)1.75
Mechanical Data下载

参数化

Additional FeaturesN/A
ArchitectureCMOS
CMRR(Min)55 dB
CMRR(Typ)72 dB
GBW(Typ)3 MHz
IIB(Max)60 pA
Iq per channel(Max)0.66 mA
Iq per channel(Typ)0.55 mA
Number of Channels4
Offset Drift(Typ)2 uV/C
Operating Temperature Range-55 to 125 C
Output Current(Typ)7 mA
Package GroupSOIC
Package Size: mm2:W x L14SOIC: 52 mm2: 6 x 8.65(SOIC) PKG
Rail-to-RailIn,Out
RatingHiRel Enhanced Product
Slew Rate(Typ)2.4 V/us
Total Supply Voltage(Max)16 +5V=5, +/-5V=10
Total Supply Voltage(Min)2.7 +5V=5, +/-5V=10
Vn at 1kHz(Typ)39 nV/rtHz
Vos (Offset Voltage @ 25C)(Max)4.5 mV

生态计划

RoHSCompliant

模型线

系列: TLV2374-EP (2)

制造商分类

  • Semiconductors > Space & High Reliability > Amplifier > Operational Amplifiers