Datasheet Texas Instruments MSP430G2230QDEP — 数据表

制造商Texas Instruments
系列MSP430G2230-EP
零件号MSP430G2230QDEP
Datasheet Texas Instruments MSP430G2230QDEP

增强型产品16位超低功耗混合信号微控制器,2kB闪存,128B RAM 8-SOIC -40至125

数据表

MSP430G2230-EP Mixed Signal Microcontroller datasheet
PDF, 997 Kb, 档案已发布: Aug 16, 2012
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin8
Package TypeD
Industry STD TermSOIC
JEDEC CodeR-PDSO-G
Package QTY75
CarrierTUBE
Device MarkingG230EP
Width (mm)3.91
Length (mm)4.9
Thickness (mm)1.58
Pitch (mm)1.27
Max Height (mm)1.75
Mechanical Data下载

参数化

ADCADC10 - 4ch
AESN/A
Active Power220 uA/MHz
Additional FeaturesWatchdog,Temp Sensor,Brown Out Reset
BSLI2C
CPUMSP430
DMA1
Frequency16 MHz
GPIO4
I2C1
Max VCC3.6
Min VCC1.8
MultiplierN/A
Non-volatile Memory2 KB
Operating Temperature Range-40 to 125 C
Package GroupSOIC
Package Size: mm2:W x L8SOIC: 29 mm2: 6 x 4.9(SOIC) PKG
RAM0.125 KB
RatingHiRel Enhanced Product
SPI1
Special I/ON/A
Standby Power0.5 LPM3-uA
Timers - 16-bit1
Wakeup Time1 us

生态计划

RoHSCompliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)
    PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
    This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430

模型线

制造商分类

  • Semiconductors > Space & High Reliability > Microcontroller > Low Power MCU > MSP430 MCU