Datasheet Texas Instruments MSP430F5227IYFFR — 数据表

制造商Texas Instruments
系列MSP430F5227
零件号MSP430F5227IYFFR
Datasheet Texas Instruments MSP430F5227IYFFR

超低功耗1.8V分离轨I / O 64-DSBGA -40至85

数据表

MSP430F522x, MSP430F521x Mixed-Signal Microcontrollers datasheet
PDF, 2.1 Mb, 修订版: G, 档案已发布: Jun 28, 2016
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin64
Package TypeYFF
Industry STD TermDSBGA
JEDEC CodeR-XBGA-N
Package QTY2500
CarrierLARGE T&R
Device MarkingM430F5227
Thickness (mm).4
Pitch (mm).4
Max Height (mm).625
Mechanical Data下载

参数化

ADCADC10 - 10ch
AESN/A
Active Power404 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators8
DMA3
Featuredf5
Frequency25 MHz
GPIO Pins53
I2C2
Max VCC3.6
Min VCC1.8
Multiplier32x32
Non-volatile Memory64 KB
Operating Temperature Range-40 to 85 C
Package GroupDSBGA
Package Size: mm2:W x LSee datasheet (DSBGA) PKG
RAM8 KB
RatingCatalog
SPI4
Special I/O1.8V I/O
Standby Power2.5 LPM3-uA
Timers - 16-bit4
UART2
Wakeup Time3.5 us

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: MSP-TS430RGC64C
    MSP-TS430RGC64C - 64-pin Target Development Board for MSP430F5x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: MSP-FET430U64C
    64-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Designing with MSP430F522x and MSP430F521x Devices
    PDF, 72 Kb, 档案已发布: Nov 30, 2012
    The MSP430F522x and MSP430F521x devices support a split supply I/O system that is essential in systems in which the MCU is required to interface with external devices (such as sensors or other processors) that operate at different voltage level compared to the MCU device supply. Additionally, the split supply input voltage range of the F522x and F521x devices starts as low as 1.62 V (see the devic
  • Using the MSP430 Timer_D Module in Hi-Resolution Mode
    PDF, 870 Kb, 档案已发布: Oct 2, 2013
    This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
  • Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
    PDF, 151 Kb, 修订版: D, 档案已发布: Nov 3, 2016
    This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the
  • General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
    PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
    Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
  • MSP Code Protection Features
    PDF, 752 Kb, 档案已发布: Dec 7, 2015
    MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
  • Design Considerations When Using the MSP430 Graphics Library
    PDF, 475 Kb, 档案已发布: Oct 5, 2012
    LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
  • ESD Diode Current Specification
    PDF, 520 Kb, 档案已发布: Dec 7, 2015
    This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

模型线

制造商分类

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430F5x/6x