Datasheet Texas Instruments MSP430FR5736IRGER — 数据表

制造商Texas Instruments
系列MSP430FR5736
零件号MSP430FR5736IRGER
Datasheet Texas Instruments MSP430FR5736IRGER

MSP430FR5736具有16 KB FRAM,1 KB SRAM,21 IO和比较器24-VQFN的24 MHz ULP微控制器-40至85

数据表

MSP430FR573x Mixed-Signal Microcontrollers datasheet
PDF, 2.3 Mb, 修订版: K, 档案已发布: Apr 25, 2016
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin2424
Package TypeRGERGE
Industry STD TermVQFNVQFN
JEDEC CodeS-PQFP-NS-PQFP-N
Package QTY30003000
CarrierLARGE T&RLARGE T&R
Device Marking5736430FR
Width (mm)44
Length (mm)44
Thickness (mm).88.88
Pitch (mm).5.5
Max Height (mm)11
Mechanical Data下载下载

参数化

ADCSlope
AESN/A
Active Power91.667 uA/MHz
Additional FeaturesReal-Time Clock,Watchdog,Brown Out Reset,IrDA
BSLUART
CPUMSP430
Comparators12
DMA3
Featuredfr5
Frequency24 MHz
GPIO Pins21
I2C1
Max VCC3.6
Min VCC2
Multiplier32x32
Non-volatile Memory16 KB
Operating Temperature Range-40 to 85 C
Package GroupVQFN
Package Size: mm2:W x L24VQFN: 16 mm2: 4 x 4(VQFN) PKG
RAM1 KB
RatingCatalog
SPI2
Security EnablerCryptographic acceleration,Debug security,Physical security,Secure FW and SW update,Software IP protection
Special I/ON/A
Standby Power6.4 LPM3-uA
Timers - 16-bit3
UART1
Wakeup Time78 us

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: MSP-TS430RHA40A
    MSP-TS430RHA40A- 40-pin Target Development Board for MSP430FRxx FRAM MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: MSP-FET430U40A
    40-pin Target Development Board and MSP-FET Programmer Bundle for MSP430F5x MCUs
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: ENERGYTRACE
    MSP EnergyTrace Technology
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Over-the-Air (OTA) Update With the MSP430FR57xx (Rev. A)
    PDF, 3.5 Mb, 修订版: A, 档案已发布: Mar 2, 2015
  • MSP430 System-Level ESD Considerations
    PDF, 1.5 Mb, 档案已发布: Mar 29, 2012
    System-Level ESD has become increasingly demanding with silicon technology scaling towards lower voltages and the need for designing cost-effective and ultra-low power components. This application report addresses three different ESD topics to help board designers and OEMs understand and design robust system-level designs:(1) Component-level ESD testing and system-level ESD testing, their differ
  • Maximizing Write Speed on the MSP430в„ў FRAM (Rev. B)
    PDF, 103 Kb, 修订版: B, 档案已发布: Feb 4, 2015
    Nonvolatile low-power ferroelectric RAM (FRAM) is capable of extremely high-speed write accesses. This application report discusses how to maximize FRAM write speeds specifically in the MSP430FRxx family using simple techniques. The document uses examples from bench tests performed on the MSP430FR5739 device, which can be extended to all MSP430в„ў FRAM-based devices, and discusses tradeoffs such as
  • MSP430 FRAM Technology – How To and Best Practices
    PDF, 326 Kb, 档案已发布: Jun 23, 2014
    FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif
  • MSP430 FRAM Quality and Reliability (Rev. A)
    PDF, 295 Kb, 修订版: A, 档案已发布: May 1, 2014
    FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura
  • Migrating from the USCI Module to the eUSCI Module (Rev. A)
    PDF, 41 Kb, 修订版: A, 档案已发布: Sep 13, 2012
    The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.
  • Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)
    PDF, 154 Kb, 修订版: A, 档案已发布: Feb 16, 2012
    This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (

模型线

制造商分类

  • Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM