Datasheet ADG608, ADG609 (Analog Devices) - 5
| 制造商 | Analog Devices |
| 描述 | 3 V/5 V, 4/8 Channel High Performance Analog Multiplexers |
| 页数 / 页 | 12 / 5 — ADG608/ADG609. ABSOLUTE MAXIMUM RATINGS1. Table I. ADG608 Truth Table. … |
| 修订版 | A |
| 文件格式/大小 | PDF / 165 Kb |
| 文件语言 | 英语 |
ADG608/ADG609. ABSOLUTE MAXIMUM RATINGS1. Table I. ADG608 Truth Table. Table II. ADG609 Truth Table. ON SWITCH. ON SWITCH PAIR
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ADG608/ADG609 ABSOLUTE MAXIMUM RATINGS1
SOIC Package (T θ A = +25°C unless otherwise noted) JA, Thermal Impedance . 77°C/W VDD to VSS . +13 V Lead Temperature, Soldering V Vapor Phase (60 sec) . +215°C DD to GND . –0.3 V to +6.5 V V Infrared (15 sec) . +220°C SS to GND . +0.3 V to –6.5 V Analog, Digital Inputs2 . –0.3 V to VDD + 2 V TSSOP Package or 20 mA, Whichever Occurs First θJA, Thermal Impedance . 158°C/W Continuous Current, S or D . 20 mA Lead Temperature, Soldering Peak Current, S or D Vapor Phase (60 sec) . +215°C (Pulsed at 1 ms, 10% Duty Cycle Max) . 40 mA Infrared (15 sec) . +220°C Operating Temperature Range ESD Rating . >5000 V Industrial (B Version) . –40°C to +85°C NOTES 1 Extended (T Version) . – 55°C to +125°C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional Storage Temperature Range . –65°C to +150°C operation of the device at these or any other conditions above those listed in the Junction Temperature . +150°C operational sections of this specification is not implied. Exposure to absolute Plastic DIP Package maximum rating conditions for extended periods may affect device reliability. θ Only one absolute maximum rating may be applied at any one time. JA, Thermal Impedance . 117°C/W 2Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should Lead Temperature, Soldering (10 sec) . +260°C be limited to the maximum ratings given.
Table I. ADG608 Truth Table Table II. ADG609 Truth Table A2 A1 A0 EN ON SWITCH A1 A0 EN ON SWITCH PAIR
X X X 0 NONE X X 0 NONE 0 0 0 1 1 0 0 1 1 0 0 1 1 2 0 1 1 2 0 1 0 1 3 1 0 1 3 0 1 1 1 4 1 1 1 4 1 0 0 1 5 X = Don’t Care 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 X = Don’t Care
PIN CONFIGURATIONS DIP/SOIC/TSSOP DIP/SOIC/TSSOP A0 1 16 A1 A0 1 16 A1 EN 2 15 GND EN 2 15 A2 V 3 14 V SS DD V GND SS 3 14 S1A 4 ADG609 13 S1B S1 4 ADG608 13 VDD TOP VIEW TOP VIEW S2A 5 12 S2B (Not to Scale) S2 5 12 (Not to Scale) S5 S3A 6 11 S3B S3 6 11 S6 S4A 7 10 S4B S4 7 10 S7 DA 8 9 DB D 8 9 S8
REV. A –5–
SOIC Package (T θ A = +25°C unless otherwise noted) JA, Thermal Impedance . 77°C/W VDD to VSS . +13 V Lead Temperature, Soldering V Vapor Phase (60 sec) . +215°C DD to GND . –0.3 V to +6.5 V V Infrared (15 sec) . +220°C SS to GND . +0.3 V to –6.5 V Analog, Digital Inputs2 . –0.3 V to VDD + 2 V TSSOP Package or 20 mA, Whichever Occurs First θJA, Thermal Impedance . 158°C/W Continuous Current, S or D . 20 mA Lead Temperature, Soldering Peak Current, S or D Vapor Phase (60 sec) . +215°C (Pulsed at 1 ms, 10% Duty Cycle Max) . 40 mA Infrared (15 sec) . +220°C Operating Temperature Range ESD Rating . >5000 V Industrial (B Version) . –40°C to +85°C NOTES 1 Extended (T Version) . – 55°C to +125°C Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional Storage Temperature Range . –65°C to +150°C operation of the device at these or any other conditions above those listed in the Junction Temperature . +150°C operational sections of this specification is not implied. Exposure to absolute Plastic DIP Package maximum rating conditions for extended periods may affect device reliability. θ Only one absolute maximum rating may be applied at any one time. JA, Thermal Impedance . 117°C/W 2Overvoltages at A, S, D or EN will be clamped by internal diodes. Current should Lead Temperature, Soldering (10 sec) . +260°C be limited to the maximum ratings given.
Table I. ADG608 Truth Table Table II. ADG609 Truth Table A2 A1 A0 EN ON SWITCH A1 A0 EN ON SWITCH PAIR
X X X 0 NONE X X 0 NONE 0 0 0 1 1 0 0 1 1 0 0 1 1 2 0 1 1 2 0 1 0 1 3 1 0 1 3 0 1 1 1 4 1 1 1 4 1 0 0 1 5 X = Don’t Care 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 X = Don’t Care
PIN CONFIGURATIONS DIP/SOIC/TSSOP DIP/SOIC/TSSOP A0 1 16 A1 A0 1 16 A1 EN 2 15 GND EN 2 15 A2 V 3 14 V SS DD V GND SS 3 14 S1A 4 ADG609 13 S1B S1 4 ADG608 13 VDD TOP VIEW TOP VIEW S2A 5 12 S2B (Not to Scale) S2 5 12 (Not to Scale) S5 S3A 6 11 S3B S3 6 11 S6 S4A 7 10 S4B S4 7 10 S7 DA 8 9 DB D 8 9 S8
REV. A –5–