Datasheet ADG5408, ADG5409 (Analog Devices) - 10

制造商Analog Devices
描述High Voltage Latch-Up Proof, 4-/8-Channel Multiplexers
页数 / 页24 / 10 — ADG5408/ADG5409. Data Sheet. PIN CONFIGURATIONS AND FUNCTION …
修订版C
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ADG5408/ADG5409. Data Sheet. PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS. 16 A1. GND. 12 GND. ADG5408. VDD. S1 2. 11 VDD. TOP VIEW

ADG5408/ADG5409 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS 16 A1 GND 12 GND ADG5408 VDD S1 2 11 VDD TOP VIEW

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ADG5408/ADG5409 Data Sheet PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS N 0 1 2 E A A A A0 1 16 A1 6 5 4 3 1 1 1 1 EN 2 15 A2 V 3 14 SS GND V 1 SS 12 GND S1 4 13 ADG5408 VDD S1 2 ADG5408 11 VDD TOP VIEW S2 5 12 S5 TOP VIEW (Not to Scale) S2 3 10 S5 (Not to Scale) S3 6 11 S6 S3 4 9 S6 S4 7 10 S7
2
5 6 7 8 8 D 9 S8
00 6-
4 D 8 7
20
S S S
09
NOTES 1. THE EXPOSED PAD IS CONNECTED INTERNALLY. FOR INCREASED RELIABILITY OF THE SOLDER JOINTS AND MAXIMUM THERMAL CAPABILITY, IT IS RECOMMENDED THAT THE PAD BE
-003
SOLDERED TO THE SUBSTRATE, VSS.
206 09 Figure 2. ADG5408 Pin Configuration (TSSOP) Figure 3. ADG5408 Pin Configuration (LFCSP)
Table 8. ADG5408 Pin Function Descriptions Pin No. TSSOP LFCSP Mnemonic Description
1 15 A0 Logic Control Input. 2 16 EN Active High Digital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 1 VSS Most Negative Power Supply Potential. In single-supply applications, this pin can be connected to ground. 4 2 S1 Source Terminal 1. This pin can be an input or an output. 5 3 S2 Source Terminal 2. This pin can be an input or an output. 6 4 S3 Source Terminal 3. This pin can be an input or an output. 7 5 S4 Source Terminal 4. This pin can be an input or an output. 8 6 D Drain Terminal. This pin can be an input or an output. 9 7 S8 Source Terminal 8. This pin can be an input or an output. 10 8 S7 Source Terminal 7. This pin can be an input or an output. 11 9 S6 Source Terminal 6. This pin can be an input or an output. 12 10 S5 Source Terminal 5. This pin can be an input or an output. 13 11 VDD Most Positive Power Supply Potential. 14 12 GND Ground (0 V) Reference. 15 13 A2 Logic Control Input. 16 14 A1 Logic Control Input. EP Exposed Pad The exposed pad is connected internally. For increased reliability of the solder joints and maximum thermal capability, it is recommended that the pad be soldered to the substrate, VSS.
Table 9. ADG5408 Truth Table A2 A1 A0 EN On Switch
X X X 0 None 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 Rev. C | Page 10 of 24 Document Outline Features Applications Functional Block Diagrams General Description Product Highlights Revision History Specifications ±15 V Dual Supply ±20 V Dual Supply 12 V Single Supply 36 V Single Supply Continuous Current per Channel, Sx or D Absolute Maximum Ratings ESD Caution Pin Configurations and Function Descriptions Typical Performance Characteristics Test Circuits Terminology Trench Isolation Applications Information Outline Dimensions Ordering Guide