Datasheet HMC637ALP5E (Analog Devices) - 4
| 制造商 | Analog Devices |
| 描述 | GaAs, pHEMT, MMIC, 1 W Power Amplifier, 0.1 GHz to 6 GHz |
| 页数 / 页 | 11 / 4 — HMC637ALP5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| 修订版 | C |
| 文件格式/大小 | PDF / 269 Kb |
| 文件语言 | 英语 |
HMC637ALP5E. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter Rating. Table 3. Thermal Resistance
该数据表的模型线
文件文字版本
HMC637ALP5E Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
Thermal performance is directly linked to printed circuit Drain Bias Voltage (VDD) 14 VDC board (PCB) design and operating environment. Careful Gate Bias Voltage attention to PCB thermal design is required. VGG1 −3 VDC to 0 VDC θJC is the junction to case thermal resistance. VGG2 4 VDC to 7 VDC RF Input Power (RFIN), VDD = 12 VDC 25 dBm
Table 3. Thermal Resistance
Channel Temperature 175°C
Package Type θ
1
JC Unit
Continuous PDISS (T = 85°C, Derate 8.6 W HCP-32-1 10.5 °C/W 95 mW/°C Above 85°C) 1 Maximum Peak Reflow Temperature 260°C (MSL31 Rating) Thermal impedance simulated values are based on a JEDEC 1S0P thermal test board. See JEDEC JESD51. Storage Temperature Range −65°C to +150°C
ESD CAUTION
Operating Temperature Range −40°C to +85°C Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Class 1B 1 MSL3 stands for Moisture Sensitivity Level 3. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 4 of 11 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Applications Information Evaluation PCB List of Materials for PCB EV1HMC637ALP5E Outline Dimensions Ordering Guide
Thermal performance is directly linked to printed circuit Drain Bias Voltage (VDD) 14 VDC board (PCB) design and operating environment. Careful Gate Bias Voltage attention to PCB thermal design is required. VGG1 −3 VDC to 0 VDC θJC is the junction to case thermal resistance. VGG2 4 VDC to 7 VDC RF Input Power (RFIN), VDD = 12 VDC 25 dBm
Table 3. Thermal Resistance
Channel Temperature 175°C
Package Type θ
1
JC Unit
Continuous PDISS (T = 85°C, Derate 8.6 W HCP-32-1 10.5 °C/W 95 mW/°C Above 85°C) 1 Maximum Peak Reflow Temperature 260°C (MSL31 Rating) Thermal impedance simulated values are based on a JEDEC 1S0P thermal test board. See JEDEC JESD51. Storage Temperature Range −65°C to +150°C
ESD CAUTION
Operating Temperature Range −40°C to +85°C Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Class 1B 1 MSL3 stands for Moisture Sensitivity Level 3. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. C | Page 4 of 11 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications Electrical Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Applications Information Evaluation PCB List of Materials for PCB EV1HMC637ALP5E Outline Dimensions Ordering Guide