Datasheet STUSB4500L (STMicroelectronics) - 17
| 制造商 | STMicroelectronics |
| 描述 | Standalone USB Type-C sink port controller |
| 页数 / 页 | 32 / 17 — STUSB4500L. Electrical characteristics. 7.1. Absolute maximum ratings. … |
| 文件格式/大小 | PDF / 1.8 Mb |
| 文件语言 | 英语 |
STUSB4500L. Electrical characteristics. 7.1. Absolute maximum ratings. Table 14. Absolute maximum ratings. Symbol. Parameter. Value
该数据表的模型线
文件文字版本
STUSB4500L Electrical characteristics 7 Electrical characteristics 7.1 Absolute maximum ratings
All voltages are referenced to GND.
Table 14. Absolute maximum ratings Symbol Parameter Value Unit
VDD Supply voltage on VDD pin 28 VSYS Supply voltage on VSYS pin 6 VCC1, VCC2 High voltage on CC pins 22 VCC1DB, VCC2DB VVBUS_EN_SNK VVBUS_VS_DISCH High voltage on VBUS pins 28 VDISCH VRP_3A V VSCL, VSDA VALERT VRESET VATTACH Operating voltage on I/O pins -0.3 to 6 VA_B_SIDE VRP_1A5 VGPIO VADDR0, VADDR1 TSTG Storage temperature -55 to 150 °C TJ Maximum junction temperature 145 HBM 3 ESD kV CDM 1.5
DS13102
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Rev 2 page 17/32
Document Outline Cover image Product status link / summary Product status link / summary Features Applications Description 1 Functional description 1.1 Block overview 2 Inputs/outputs 2.1 Pinout 2.2 Pin description 2.2.1 CC1 / CC2 2.2.2 CC1DB / CC2DB 2.2.3 RESET 2.2.4 I²C interface pins 2.2.5 DISCH 2.2.6 GND 2.2.7 ATTACH 2.2.8 RP_3A/RP_1A5 2.2.9 GPIO 2.2.10 VBUS_EN_SNK 2.2.11 A_B_SIDE 2.2.12 VBUS_VS_DISCH 2.2.13 VREG_1V2 2.2.14 VSYS 2.2.15 VREG_2V7 2.2.16 VDD 3 Description of the features 3.1 CC interface 3.2 VBUS power path control 3.2.1 VBUS monitoring 3.2.2 VBUS discharge 3.2.3 VBUS power path assertion 3.3 Dead battery mode 3.4 High voltage protections 3.5 Hardware fault management 3.6 Debug accessory mode detection 4 I²C Interface 4.1 Read and write operations 4.2 Timing specifications 5 Start-up configuration 5.1 User-defined parameters 5.2 Default start-up configuration 6 Application 6.1 General information 6.1.1 Power supplies 6.1.2 Connection to MCU or application processor 6.2 Typical application 7 Electrical characteristics 7.1 Absolute maximum ratings 7.2 Operating conditions 7.3 Electrical and timing characteristics 8 Package information 8.1 QFN-24 EP (4x4) package information 8.2 WLCSP (2.6x2.6x0.5) 25 bumps package information 8.3 Thermal information 9 Terms and abbreviations Revision history
All voltages are referenced to GND.
Table 14. Absolute maximum ratings Symbol Parameter Value Unit
VDD Supply voltage on VDD pin 28 VSYS Supply voltage on VSYS pin 6 VCC1, VCC2 High voltage on CC pins 22 VCC1DB, VCC2DB VVBUS_EN_SNK VVBUS_VS_DISCH High voltage on VBUS pins 28 VDISCH VRP_3A V VSCL, VSDA VALERT VRESET VATTACH Operating voltage on I/O pins -0.3 to 6 VA_B_SIDE VRP_1A5 VGPIO VADDR0, VADDR1 TSTG Storage temperature -55 to 150 °C TJ Maximum junction temperature 145 HBM 3 ESD kV CDM 1.5
DS13102
-
Rev 2 page 17/32
Document Outline Cover image Product status link / summary Product status link / summary Features Applications Description 1 Functional description 1.1 Block overview 2 Inputs/outputs 2.1 Pinout 2.2 Pin description 2.2.1 CC1 / CC2 2.2.2 CC1DB / CC2DB 2.2.3 RESET 2.2.4 I²C interface pins 2.2.5 DISCH 2.2.6 GND 2.2.7 ATTACH 2.2.8 RP_3A/RP_1A5 2.2.9 GPIO 2.2.10 VBUS_EN_SNK 2.2.11 A_B_SIDE 2.2.12 VBUS_VS_DISCH 2.2.13 VREG_1V2 2.2.14 VSYS 2.2.15 VREG_2V7 2.2.16 VDD 3 Description of the features 3.1 CC interface 3.2 VBUS power path control 3.2.1 VBUS monitoring 3.2.2 VBUS discharge 3.2.3 VBUS power path assertion 3.3 Dead battery mode 3.4 High voltage protections 3.5 Hardware fault management 3.6 Debug accessory mode detection 4 I²C Interface 4.1 Read and write operations 4.2 Timing specifications 5 Start-up configuration 5.1 User-defined parameters 5.2 Default start-up configuration 6 Application 6.1 General information 6.1.1 Power supplies 6.1.2 Connection to MCU or application processor 6.2 Typical application 7 Electrical characteristics 7.1 Absolute maximum ratings 7.2 Operating conditions 7.3 Electrical and timing characteristics 8 Package information 8.1 QFN-24 EP (4x4) package information 8.2 WLCSP (2.6x2.6x0.5) 25 bumps package information 8.3 Thermal information 9 Terms and abbreviations Revision history