Datasheet NCD2400M (IXYS) - 2
| 制造商 | IXYS |
| 描述 | Wide Capacitance Range, Non-volatileDigital Programmable Capacitor |
| 页数 / 页 | 22 / 2 — NCD2400M. 1. Specifications . 3. 2. Performance Data . 6. 3. Functional … |
| 文件格式/大小 | PDF / 414 Kb |
| 文件语言 | 英语 |
NCD2400M. 1. Specifications . 3. 2. Performance Data . 6. 3. Functional Description . 11
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link to page 3 link to page 3 link to page 3 link to page 3 link to page 3 link to page 3 link to page 4 link to page 4 link to page 5 link to page 5 link to page 5 link to page 6 link to page 11 link to page 11 link to page 12 link to page 13 link to page 13 link to page 13 link to page 13 link to page 13 link to page 13 link to page 14 link to page 14 link to page 15 link to page 17 link to page 18 link to page 19 link to page 19 link to page 19 link to page 20 link to page 21 link to page 21 link to page 21 link to page 21 link to page 21 link to page 22 link to page 22 link to page 22 INTEGRATED CIRCUITS DIVISION
NCD2400M 1. Specifications . 3
1.1 Package Pinout . 3 1.2 Pin Descriptions . 3 1.3 Absolute Maximum Ratings . 3 1.4 Recommended Operating Conditions . 3 1.5 ESD Rating . 3 1.6 General Conditions for Electrical Characteristics. 4 1.7 Capacitor Electrical Characteristics . 4 1.8 Digital Interface: Electrical Characteristics of SDA and SCL . 5 1.9 Digital Interface: AC Characteristics . 5 1.10 Power Supply. 5
2. Performance Data . 6 3. Functional Description . 11
3.1 Introduction . 11 3.2 Capacitive Digital to Analog Converter (CDAC). 12 3.3 Non-Volatile Memory Configuration . 13 3.4 Device Address . 13 3.5 Operating Modes . 13 3.5.1 Volatile Mode . 13 3.5.2 Non-Volatile Mode . 13 3.6 I2C Serial Interface. 13 3.6.1 Write Commands . 14 3.6.2 Write Volatile Register Operation . 14 3.6.3 Write Non-Volatile Memory Operation . 15 3.6.4 Read Operation. 17 3.6.5 Set Non-Volatile Mode Operation . 18 3.6.6 Electrical and Timing Considerations . 19 3.6.7 Application Diagrams . 19 3.7 Capacitor Interface Electrical and Biasing Considerations . 19
4. Capacitance Determination and Programming Procedure . 20 5. Manufacturing Information . 21
5.1 Moisture Sensitivity . 21 5.2 ESD Sensitivity . 21 5.3 Soldering Profile. 21 5.4 Board Wash . 21 5.5 Mechanical Dimensions . 22 5.5.1 Package Dimensions . 22 5.5.2 Tape & Reel Specification. 22 2
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R01 Document Outline Features Applications Description 1. Specifications 1.1 Package Pinout 1.2 Pin Descriptions 1.3 Absolute Maximum Ratings 1.4 Recommended Operating Conditions 1.5 ESD Rating 1.6 General Conditions for Electrical Characteristics 1.7 Capacitor Electrical Characteristics 1.8 Digital Interface: Electrical Characteristics of SDA and SCL 1.9 Digital Interface: AC Characteristics 1.10 Power Supply 2. Performance Data 3. Functional Description 3.1 Introduction 3.2 Capacitive Digital to Analog Converter (CDAC) 3.3 Non-Volatile Memory Configuration 3.4 Device Address 3.5 Operating Modes 3.5.1 Volatile Mode 3.5.2 Non-Volatile Mode 3.6 I2C Serial Interface 3.6.1 Write Commands 3.6.2 Write Volatile Register Operation 3.6.3 Write Non-Volatile Memory Operation 3.6.4 Read Operation 3.6.5 Set Non-Volatile Mode Operation 3.6.6 Electrical and Timing Considerations 3.6.7 Application Diagrams 3.7 Capacitor Interface Electrical and Biasing Considerations 4. Capacitance Determination and Programming Procedure 5. Manufacturing Information 5.1 Moisture Sensitivity 5.2 ESD Sensitivity 5.3 Soldering Profile 5.4 Board Wash 5.5 Mechanical Dimensions 5.5.1 Package Dimensions 5.5.2 Tape & Reel Specification
NCD2400M 1. Specifications . 3
1.1 Package Pinout . 3 1.2 Pin Descriptions . 3 1.3 Absolute Maximum Ratings . 3 1.4 Recommended Operating Conditions . 3 1.5 ESD Rating . 3 1.6 General Conditions for Electrical Characteristics. 4 1.7 Capacitor Electrical Characteristics . 4 1.8 Digital Interface: Electrical Characteristics of SDA and SCL . 5 1.9 Digital Interface: AC Characteristics . 5 1.10 Power Supply. 5
2. Performance Data . 6 3. Functional Description . 11
3.1 Introduction . 11 3.2 Capacitive Digital to Analog Converter (CDAC). 12 3.3 Non-Volatile Memory Configuration . 13 3.4 Device Address . 13 3.5 Operating Modes . 13 3.5.1 Volatile Mode . 13 3.5.2 Non-Volatile Mode . 13 3.6 I2C Serial Interface. 13 3.6.1 Write Commands . 14 3.6.2 Write Volatile Register Operation . 14 3.6.3 Write Non-Volatile Memory Operation . 15 3.6.4 Read Operation. 17 3.6.5 Set Non-Volatile Mode Operation . 18 3.6.6 Electrical and Timing Considerations . 19 3.6.7 Application Diagrams . 19 3.7 Capacitor Interface Electrical and Biasing Considerations . 19
4. Capacitance Determination and Programming Procedure . 20 5. Manufacturing Information . 21
5.1 Moisture Sensitivity . 21 5.2 ESD Sensitivity . 21 5.3 Soldering Profile. 21 5.4 Board Wash . 21 5.5 Mechanical Dimensions . 22 5.5.1 Package Dimensions . 22 5.5.2 Tape & Reel Specification. 22 2
www.ixysic.com
R01 Document Outline Features Applications Description 1. Specifications 1.1 Package Pinout 1.2 Pin Descriptions 1.3 Absolute Maximum Ratings 1.4 Recommended Operating Conditions 1.5 ESD Rating 1.6 General Conditions for Electrical Characteristics 1.7 Capacitor Electrical Characteristics 1.8 Digital Interface: Electrical Characteristics of SDA and SCL 1.9 Digital Interface: AC Characteristics 1.10 Power Supply 2. Performance Data 3. Functional Description 3.1 Introduction 3.2 Capacitive Digital to Analog Converter (CDAC) 3.3 Non-Volatile Memory Configuration 3.4 Device Address 3.5 Operating Modes 3.5.1 Volatile Mode 3.5.2 Non-Volatile Mode 3.6 I2C Serial Interface 3.6.1 Write Commands 3.6.2 Write Volatile Register Operation 3.6.3 Write Non-Volatile Memory Operation 3.6.4 Read Operation 3.6.5 Set Non-Volatile Mode Operation 3.6.6 Electrical and Timing Considerations 3.6.7 Application Diagrams 3.7 Capacitor Interface Electrical and Biasing Considerations 4. Capacitance Determination and Programming Procedure 5. Manufacturing Information 5.1 Moisture Sensitivity 5.2 ESD Sensitivity 5.3 Soldering Profile 5.4 Board Wash 5.5 Mechanical Dimensions 5.5.1 Package Dimensions 5.5.2 Tape & Reel Specification