Datasheet Texas Instruments TLV2472 — 数据表
| 制造商 | Texas Instruments |
| 系列 | TLV2472 |
双路低功耗轨至轨输入/输出运算放大器
数据表
Family of 600uA/Ch 2.8MHz Rail-to-Rail I/O High-Drive Op Amps with Shutdown datasheet
PDF, 2.9 Mb, 修订版: E, 档案已发布: Jul 3, 2007
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价格
状态
| TLV2472CD | TLV2472CDG4 | TLV2472CDGN | TLV2472CDGNR | TLV2472CDGNRG4 | TLV2472CDR | TLV2472CDRG4 | TLV2472CP | TLV2472ID | TLV2472IDG4 | TLV2472IDGN | TLV2472IDGNG4 | TLV2472IDGNR | TLV2472IDGNRG4 | TLV2472IDR | TLV2472IDRG4 | TLV2472IP | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | Yes | Yes | Yes | Yes | No | Yes | No | Yes | Yes | Yes | No | No | No | Yes | No |
打包
| TLV2472CD | TLV2472CDG4 | TLV2472CDGN | TLV2472CDGNR | TLV2472CDGNRG4 | TLV2472CDR | TLV2472CDRG4 | TLV2472CP | TLV2472ID | TLV2472IDG4 | TLV2472IDGN | TLV2472IDGNG4 | TLV2472IDGNR | TLV2472IDGNRG4 | TLV2472IDR | TLV2472IDRG4 | TLV2472IP | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 | 16 | 17 |
| Pin | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Package Type | D | D | DGN | DGN | DGN | D | D | P | D | D | DGN | DGN | DGN | DGN | D | D | P |
| Industry STD Term | SOIC | SOIC | HVSSOP | HVSSOP | HVSSOP | SOIC | SOIC | PDIP | SOIC | SOIC | HVSSOP | HVSSOP | HVSSOP | HVSSOP | SOIC | SOIC | PDIP |
| JEDEC Code | R-PDSO-G | R-PDSO-G | S-PDSO-G | S-PDSO-G | S-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDIP-T | R-PDSO-G | R-PDSO-G | S-PDSO-G | S-PDSO-G | S-PDSO-G | S-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDIP-T |
| Package QTY | 75 | 75 | 80 | 2500 | 2500 | 2500 | 2500 | 50 | 75 | 75 | 80 | 80 | 2500 | 2500 | 2500 | 2500 | 50 |
| Carrier | TUBE | TUBE | TUBE | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | TUBE | TUBE | TUBE | TUBE | TUBE | LARGE T&R | LARGE T&R | LARGE T&R | LARGE T&R | TUBE |
| Device Marking | 2472C | 2472C | ABU | ABU | ABU | 2472C | 2472C | TLV2472CP | 2472I | 2472I | ABV | ABV | ABV | ABV | 2472I | 2472I | TLV2472IP |
| Width (mm) | 3.91 | 3.91 | 3 | 3 | 3 | 3.91 | 3.91 | 6.35 | 3.91 | 3.91 | 3 | 3 | 3 | 3 | 3.91 | 3.91 | 6.35 |
| Length (mm) | 4.9 | 4.9 | 3 | 3 | 3 | 4.9 | 4.9 | 9.81 | 4.9 | 4.9 | 3 | 3 | 3 | 3 | 4.9 | 4.9 | 9.81 |
| Thickness (mm) | 1.58 | 1.58 | 1.02 | 1.02 | 1.02 | 1.58 | 1.58 | 3.9 | 1.58 | 1.58 | 1.02 | 1.02 | 1.02 | 1.02 | 1.58 | 1.58 | 3.9 |
| Pitch (mm) | 1.27 | 1.27 | .65 | .65 | .65 | 1.27 | 1.27 | 2.54 | 1.27 | 1.27 | .65 | .65 | .65 | .65 | 1.27 | 1.27 | 2.54 |
| Max Height (mm) | 1.75 | 1.75 | 1.1 | 1.1 | 1.1 | 1.75 | 1.75 | 5.08 | 1.75 | 1.75 | 1.1 | 1.1 | 1.1 | 1.1 | 1.75 | 1.75 | 5.08 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 |
参数化
| Parameters / Models | TLV2472CD | TLV2472CDG4 | TLV2472CDGN | TLV2472CDGNR | TLV2472CDGNRG4 | TLV2472CDR | TLV2472CDRG4 | TLV2472CP | TLV2472ID | TLV2472IDG4 | TLV2472IDGN | TLV2472IDGNG4 | TLV2472IDGNR | TLV2472IDGNRG4 | TLV2472IDR | TLV2472IDRG4 | TLV2472IP |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Additional Features | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Architecture | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| CMRR(Min), dB | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| CMRR(Typ), dB | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 | 84 |
| GBW(Typ), MHz | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 | 2.8 |
| Input Bias Current(Max), pA | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 | 50 |
| Iq per channel(Max), mA | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 | 0.9 |
| Iq per channel(Typ), mA | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 |
| Number of Channels | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Offset Drift(Typ), uV/C | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 | 0.4 |
| Operating Temperature Range, C | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 | -40 to 125,0 to 70 |
| Output Current(Typ), mA | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
| Package Group | SOIC | SOIC | MSOP-PowerPAD | MSOP-PowerPAD | MSOP-PowerPAD | SOIC | SOIC | PDIP | SOIC | SOIC | MSOP-PowerPAD | MSOP-PowerPAD | MSOP-PowerPAD | MSOP-PowerPAD | SOIC | SOIC | PDIP |
| Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | See datasheet (PDIP) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8MSOP-PowerPAD: 15 mm2: 4.9 x 3(MSOP-PowerPAD) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | See datasheet (PDIP) |
| Rail-to-Rail | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out | In,Out |
| Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
| Slew Rate(Typ), V/us | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
| Total Supply Voltage(Max), +5V=5, +/-5V=10 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| Total Supply Voltage(Min), +5V=5, +/-5V=10 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 | 2.7 |
| Vn at 1kHz(Typ), nV/rtHz | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 | 15 |
| Vos (Offset Voltage @ 25C)(Max), mV | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 | 2.2 |
生态计划
| TLV2472CD | TLV2472CDG4 | TLV2472CDGN | TLV2472CDGNR | TLV2472CDGNRG4 | TLV2472CDR | TLV2472CDRG4 | TLV2472CP | TLV2472ID | TLV2472IDG4 | TLV2472IDGN | TLV2472IDGNG4 | TLV2472IDGNR | TLV2472IDGNRG4 | TLV2472IDR | TLV2472IDRG4 | TLV2472IP | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Pb Free | Yes | Yes |
应用须知
- Thermistor Temperature Transducer to ADC ApplicationPDF, 74 Kb, 档案已发布: Sep 22, 2000
An interchangeable-thermistor temperature-measurement application is described and a basic framework circuit which can be modified to use alternative components is provided. When a potentiometer is used instead of a thermistor, the application can also be used to measure other process variables. A basic understanding of active and passive analog devices is assumed. - Use of Rail-to-Rail Operational Amplifiers (Rev. A)PDF, 159 Kb, 修订版: A, 档案已发布: Dec 22, 1999
This application report assists design engineers to understand the functionality and benefits of rail-to-rail operational amplifiers. It shows simplified schematics, functions, and characteristics of the input and output stages. Typical application schematics for rail-to-rail operational amplifiers are also discussed.
模型线
系列: TLV2472 (17)
制造商分类
- Semiconductors> Amplifiers> Operational Amplifiers (Op Amps)> Precision Op Amps