Datasheet Texas Instruments LM2596S-ADJ/NOPB — 数据表

制造商Texas Instruments
系列LM2596
零件号LM2596S-ADJ/NOPB
Datasheet Texas Instruments LM2596S-ADJ/NOPB

SIMPLESWITCHER®4.5V至40V,3A低组件数降压稳压器5-DDPAK / TO-263 -40至125

数据表

LM2596 SIMPLE SWITCHERВ® Power Converter 150-kHz 3-A Step-Down Voltage Regulator datasheet
PDF, 5.1 Mb, 修订版: D, 档案已发布: May 31, 2016
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

Pin55
Package TypeKTTKTT
Industry STD TermTO-263TO-263
JEDEC CodeR-PSFM-GR-PSFM-G
Package QTY4545
CarrierTUBETUBE
Device Marking-ADJ P+LM2596S
Width (mm)8.428.42
Length (mm)10.1610.16
Thickness (mm)4.584.58
Pitch (mm)1.71.7
Max Height (mm)4.834.83
Mechanical Data下载下载

参数化

Control ModeVoltage Mode
Duty Cycle(Max)100 %
Iout(Max)3 A
Iq(Typ)5 mA
Operating Temperature Range-40 to 125 C
Package GroupDDPAK/TO-263
RatingCatalog
Regulated Outputs1
Special FeaturesEnable
Switching Frequency(Max)173 kHz
Switching Frequency(Min)110 kHz
TypeConverter
Vin(Max)40 V
Vin(Min)4.5 V
Vout(Max)37 V
Vout(Min)3.3 V

生态计划

RoHSCompliant
Pb FreeYes

设计套件和评估模块

  • Evaluation Modules & Boards: LM2596S-ADJEVM
    LM2596 Step-Down Converter Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, 档案已发布: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, 修订版: B, 档案已发布: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
  • Buck Converters Provide a Battery Charger and System Power
    PDF, 61 Kb, 档案已发布: Mar 21, 2007
  • Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
    PDF, 512 Kb, 修订版: A, 档案已发布: Sep 12, 2014
    Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
  • Simple Techniques Minimize Cross-Coupling in Distributed Power Systems
    PDF, 335 Kb, 档案已发布: Mar 21, 2007
  • AN-1082 Adjust or Synchronize LM2586/88 Switching Frequency (Rev. B)
    PDF, 69 Kb, 修订版: B, 档案已发布: Apr 23, 2013
    Switching frequency is a very important parameter in switching power converters. As the switchingfrequency increases, the physical size of magnetic elements and other components in the circuit reducesignificantly. Switching frequency also plays a great role in control loop gain and compensation design.Switching frequency determines the maximum allowable bandwidth of the control loop. Switchi
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1081 Low-Cost Low-Parts-Count DC/DC Converter With Multiple Outputs (Rev. B)
    PDF, 124 Kb, 修订版: B, 档案已发布: Apr 23, 2013
    This application report describes a simple low cost, low parts-count multiple output DC/DC converterbased on the LM2596 five terminal step-down switching regulator. The circuit described provides multipleoutput voltages (positive and negative) with good regulation using a step-down converter circuit withflyback windings. It uses only one switching regulator IC.
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
    PDF, 427 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application note discusses stresses in wide input DC-DC converters.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

模型线

制造商分类

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)

其他名称:

LM2596SADJ/NOPB, LM2596S ADJ/NOPB